[ima6] EPJST submission by Semenov Sergey et al.pdf (333.38 kB)
Evaporation of pinned sessile microdroplets of water on a highly heat-conductive substrate: Computer simulations
journal contribution
posted on 2017-07-17, 09:08 authored by Sergey Semenov, Victor Starov, Ramon RubioThe aim of the current numerical study is to investigate the influence of individual effects (kinetic effects, latent heat of vaporization, Marangoni convection, Stefan flow, droplet’s surface curvature) on the rate of evaporation of a water droplet placed on a highly heat conductive substrate for different sizes of the droplet (down to submicron sizes). We performed simulations for one particular set of parameters: the ambient relative air humidity is set to 70%, the ambient temperature is 20 ∘C, the contact angle is 90∘, and the substrate material is copper. The Suggested model combines both diffusive and kinetic models of evaporation. The obtained results allow estimation of the characteristic droplet sizes where each of the mentioned above phenomena becomes important or can be neglected.
Funding
This work has been done under the umbrella of COST Action MP1106. Research was supported by the European Union under Grant MULTIFLOW FP7-ITN-2008-214919, and EPSRC UK grant EP/D077869/1.
History
School
- Aeronautical, Automotive, Chemical and Materials Engineering
Department
- Chemical Engineering
Published in
European Physical Journal: Special TopicsVolume
219Issue
1Pages
143 - 154Citation
SEMENOV, S., STAROV, V. and RUBIO, R., 2013. Evaporation of pinned sessile microdroplets of water on a highly heat-conductive substrate: Computer simulations. European Physical Journal: Special Topics, 219(1), pp. 143-154.Publisher
© EDP Sciences. Published by SpringerVersion
- AM (Accepted Manuscript)
Publisher statement
This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/Publication date
2013Notes
The final publication is available at Springer via http://dx.doi.org/10.1140/epjst/e2013-01789-yISSN
1951-6355eISSN
1951-6401Publisher version
Language
- en