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The use of post-electroplating surface modification treatments to mitigate tin whisker growth

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conference contribution
posted on 2017-07-21, 14:16 authored by Dan Haspel, Mark Ashworth, Geoffrey Wilcox, Xujin BaoXujin Bao
The use of post-electroplating surface modification treatments to mitigate tin whisker growth

Funding

The authors would like to thank both the UK EPSRC Innovative Electronics Manufacturing Research Centre for funding this research through the WHISKERMIT programme and the Loughborough University Materials Research School.

History

School

  • Aeronautical, Automotive, Chemical and Materials Engineering

Department

  • Materials

Published in

8th Electronic Materials and Processes for Space (EMPS) Workshop

Citation

HASPEL, D. ... et al, 2017. The use of post-electroplating surface modification treatments to mitigate tin whisker growth. Presented at: Electronic Materials and Processes for Space (EMPS) Workshop, EMPS-8, ESA/ESTEC, Noordwijk, The Netherlands, 10th-12th May 2017.

Publisher

EMPS

Version

  • VoR (Version of Record)

Publisher statement

This work is made available according to the conditions of the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International (CC BY-NC-ND 4.0) licence. Full details of this licence are available at: https://creativecommons.org/licenses/by-nc-nd/4.0/

Acceptance date

2017-03-20

Publication date

2017

Notes

This is a PowerPoint presentation.

Publisher version

Language

  • en

Location

ESA/ESTEC, Noordwijk, The Netherlands

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    Keywords

    untaggedMaterials Engineering not elsewhere classified

    Licence

    CC BY-NC-ND 4.0

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