The characterisation and termination of lossless coupled transmission lines for high speed logic circuits

As the speed of logic integrated circuits increases, the effects of the package and the interconnections become more significant. Hybrid technology can be used to eliminate the need for individual packaging of the integrated circuits but now the interconnections are generally closer together and must be considered as a coupled system. Therefore it is very important to have a general method of analysing multiconductor transmission line structures as found in high speed logic systems. [Continues.]