ESTC Paper 162 Zhou.pdf (544.99 kB)
Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy
conference contribution
posted on 2019-02-22, 09:45 authored by Zhaoxia ZhouZhaoxia Zhou, Li Liu, Changqing LiuThe present investigation aimed to use in-situ heating experiment in a transmission electron microscope (TEM) to live characterize the thermal stability of a Cu/Ni-W-P interlayer/ZnAl solder interconnect. It demonstrated the TEM was able to detect live intermetallic compounds (IMCs) growth during heating. In addition, stress building up was evidenced by the progressive evolving of the dislocations at the interface between NiW-P interlayer and the ZnAl Solder. However, due to the μm to nm scale of specimens' dimensions required for electron microscopy, the sample preparation and data interpretation remains a challenge.
Funding
This work is supported by UK EPSRC Underpinning Power Electronics 2017: Heterogeneous Integration (EP/R004501/1), 2017-2020.
History
School
- Mechanical, Electrical and Manufacturing Engineering
Published in
2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - ProceedingsCitation
ZHOU, Z., LIU, L. and LIU, C., 2018. Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy. Presented at the 2018 7th Electronic System-Integration Technology Conference (ESTC), Dresden, Germany, 18-21 September 2018.Publisher
© IEEEVersion
- AM (Accepted Manuscript)
Publication date
2018Notes
© 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.ISBN
9781538668146Publisher version
Language
- en