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A process model of the infra-red reflow soldering of printed circuit board assemblies

online resource

posted on 2008-11-03, 16:54 authored by David Whalley, Adebayo Oluyinka Ogunjimi, Paul ConwayPaul Conway, David Williams

This paper presents the latest results of an evolving model of the infra-red reflow soldering process. Recent additions to earlier models are the convective cooling of the PCB as it exits from the furnace muffle, and the addition of realistic component structures to the PCB assembly. The paper also presents the initial results from a second model of a hgh production volume, hgh quality, mass manufacture oven.

History

School

Mechanical, Electrical and Manufacturing Engineering

Citation

WHALLEY, D.C. ... et al, 1991. A process model of the infra-red reflow soldering of printed circuit board assemblies. IN: Proceedings of the 11th IEEE International Electronic Manufacturing Technology Symposium, San Francisco, 16-18th September, pp. 122-125. [DOI: 10.1109/IEMT.1991.279761]

Publisher

Publication date

1991

Notes

This is a conference paper [© IEEE] and is also available online at: http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=279761&isnumber=6930 Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.