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IGBT package design for high power aircraft electronic systems
online resource
posted on 2008-11-07, 16:57 authored by Farhad Sarvar, David WhalleyThis paper will discuss the design of semiconductor packages
having integrated air cooled heatsinks for use in high power
electronic systems. It will demonstrate how simple models of
the heat transfer from the heatsink fins, which are based on
empirical correlations, may be utilised in combination with
either simple analytical models or two dimensional finite
difference (FD) models of the heat conduction from the
semiconductor die through the multilayer package structure to
the base of the fins. These models allow the rapid evaluation
of performance under both steady state and transient overload
conditions, and can be used to rapidly explore a wide range of
design options before selecting candidate layouts for more
detailed evaluation using, for example, 3D FD analysis.
Wind tunnel experiments, which will also be reported, have
been carried out to verify the modelling results for different
semiconductor device layouts. These trials demonstrate
excellent agreement between the models and experimental
results.
History
School
- Mechanical, Electrical and Manufacturing Engineering
Citation
SARVAR, F. and WHALLEY, D.C., 2000. IGBT package design for high power aircraft electronic systems. IN: 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, (ITHERM 2000), May 23 - 26, Las Vegas, Nevada, vol 2, pp. 391-397Publisher
© IEEEPublication date
2000Notes
This is a conference paper and the definitive version is also available at: http://ieeexplore.ieee.org. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.ISBN
0780359127Language
- en