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Electrical conduction characteristics of solid metal anisotropic conductive adhesive particles
online resource
posted on 2008-11-13, 15:05 authored by Guangbin Dou, David Whalley, Changqing LiuAnisotropic Conductive Adhesives (ACAs) have been
used in fine pitch electronics packaging for over a decade and
provide a high density and low temperature bonding method
in a range of niche applications. In an ACA assembly,
individual particles act as electrical conductors, providing
current paths for fine pitch electronics interconnections. This
paper presents a model of the electrical conduction
characteristics of the solid metal particles used in some ACAs.
Conduction through such ACA particles results from contact
between the component and substrate pads and the particle,
which is deformed by the assembly process. In order to
investigate the effect of the extent of particle deformation, or
transformation degree, upon the particle resistance, the
particle transformation factor is defined. A mathematical
model of the electrical resistance of an ACA particle, which is
an integral function of the transformation factor and the
particle geomehy, has been developed from a physical model
of the ACA particle. MuthCAD software has been used to
provide solutions for this function. According to these
numerical solutions, the greater the particle transformation,
the lower the particle resistance will be. In conclusion, it is
shown that the ACA particle resistance is determined by the
particle transformation and the particle geometries. Finally,
the resistance function will explain the conductive mechanism
of a deformed metal ACA particle.
History
School
- Mechanical, Electrical and Manufacturing Engineering
Citation
DOU, G., WHALLEY, D.C. and LIU, C., 2004. Electrical conduction characteristics of solid metal anisotropic conductive adhesive particles. IN : 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, (POLYTRONIC 2004), 12-15 September, Portland USA, pp. 132-136.Publisher
© IEEEPublication date
2004Notes
This is a conference paper and the definitive version is also available at: http://ieeexplore.ieee.org. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.ISBN
0780387449Language
- en