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Propagation modes of surface discharge plasma in a metallized polymer film capacitor

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conference contribution
posted on 2009-08-21, 10:18 authored by Yuen-Pen Lee, Michael G. Kong
Surface breakdowns and their associated discharges are an important failure mechanism of metallized polymer film capacitors. To assess propagation of such discharges on the electrode coating surface and hence the impact on capacitor performance, we have recently developed a surface plasma model under non-equilibrium conditions. Through the identification of an electrical field mechanism and a temperature gradient mechanism, we have established a parametric range within which these surface plasmas are unlikely to elongate. Theoretical models of surface discharges are useful for a quantitative understanding of failure mechanisms in film capacitors. In this contribution, we extend our work farther to study the dynamics of plasma propagation. Two propagation modes are identified, namely the elongation and extinction modes, and they are numerically explored over a very wide parametric range. Detailed features of plasma propagation provide important insights into their impact on capacitor performance. These results are also useful to aid optimization of capacitor designs through capacitor electrode architecture and insulation clearance

History

School

  • Mechanical, Electrical and Manufacturing Engineering

Citation

LEE, Y.P. and KONG, M.G., 2001. Propagation modes of surface discharge plasma in a metallized polymer film capacitor. IN: 2001 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, 14-17 Oct., Kitchener, Ont., Canada, pp. 192-196.

Publisher

© IEEE

Version

  • VoR (Version of Record)

Publication date

2001

Notes

This is a conference paper [© IEEE]. It is also available at: http://ieeexplore.ieee.org/ Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.

ISBN

0780370538

Language

  • en

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