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A time-strain monitoring system fabricated via offset lithographic printing
journal contribution
posted on 2014-06-13, 12:53 authored by Gareth I. Hay, Darren SoutheeDarren Southee, Peter S.A. Evans, David J. Harrison, George Simpson, J. WoodThis paper reports progress in the development of strain sensors fabricated using the conductive
lithographic film (CLF) printing process. Strain sensitive structures printed via an unmodified
offset lithographic printing press using a silver-loaded conductive ink have been deposited
concurrently with circuit interconnect, to form an electronic smart packaging system. A system
populated with surface mount technology (SMT) components has proven successful in
interpreting and logging deformation incidences subjected to a package during testing. It is
proposed that with further development such a system could be printed synchronously with
packaging graphics using a single printing process to form an integrated time–strain monitoring
system.
History
School
- Design
Published in
SMART MATERIALS & STRUCTURESVolume
18Issue
1Pages
? - ? (10)Citation
HAY, G.I. ... et al, 2009. A time-strain monitoring system fabricated via offset lithographic printing. Smart Materials and Structures, 18 (1), 015015.Publisher
© IOP Publishing LtdVersion
- VoR (Version of Record)
Publication date
2009Notes
This article is closed access.ISSN
0964-1726Publisher version
Language
- en