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The thermal stability of alkanethiol self-assembled monolayers on copper for fluxless soldering applications
journal contribution
posted on 2010-11-12, 14:43 authored by Stephen Ebbens, David HuttDavid Hutt, Changqing LiuThe ability of alkanethiol monolayers deposited
on copper to prevent surface oxidation has suggested their
application as preservatives for fluxless soldering. However, the
utility of such coatings for this purpose will critically depend
on their ability to continue to preserve the substrate during
exposure to elevated temperatures throughout the electronics
manufacturing process. Consequently, the aim of this paper is to
systematically determine the effect of storage temperature and
duration on the ability of alkanethiol coated copper samples to
undergo fluxless soldering. Similarly, the effect of pre-heating
copper immediately prior to soldering is also investigated. The
effect of reducing atmospheric oxygen concentration during
storage and soldering is also considered as a potential route
to improve the thermal resilience of the coatings. Parallel to
ascertaining these industrially relevant performance parameters,
a quantitative correlation between surface chemistry and solder
wetting is established, and the temperature dependence of the
kinetics of surface oxidation through an alkanethiol barrier layer
is discussed.
History
School
- Mechanical, Electrical and Manufacturing Engineering
Citation
EBBENS, S., HUTT, D.A. and LIU, C., 2010. The thermal stability of alkanethiol self-assembled monolayers on copper for fluxless soldering applications. IEEE Transactions on Components and Packaging Technologies, 33(2), pp. 251-259.Publisher
© IEEEVersion
- VoR (Version of Record)
Publication date
2010Notes
This is a journal article [© IEEE]. It is also available at: http://ieeexplore.ieee.org/ Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.ISSN
1521-3331Publisher version
Language
- en