Loughborough University
Leicestershire, UK
LE11 3TU
+44 (0)1509 263171
Loughborough University

Loughborough University Institutional Repository

Browsing by Author Chan, Y.C.

Jump to: 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
or enter first few letters:   
Sort by: In order: Results/Page Authors/Record:
Showing results 2 to 8 of 8
Issue DateTitleAuthor(s)
2015Microstructural and mechanical analysis on Cu–Sn intermetallic micro-joints under isothermal conditionChen, Guang; Wu, Fengshun; Liu, Changqing; Silberschmidt, Vadim V.; Chan, Y.C.
2016Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheetsChen, Guang; Wu, Fengshun; Liu, Changqing; Silberschmidt, Vadim V.; Chan, Y.C.
2016Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: physical properties, solderability and microstructural evolution under isothermal ageingChen, Guang; Peng, Hao; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun
2016Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycleChen, Guang; Liu, Li; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun
2006RLC effects in fine pitch anisotropic conductive film connectionsDou, Guangbin; Chan, Y.C.; Morris, J.E.; Whalley, David C.
2000Study of self-alignment of μBGA packagesHung, K.C.; Chan, Y.C.; Tu, P.L.; Ong, H.C.; Webb, D.P.; Lai, J.K.L.
2016Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticlesChen, Guang; Liu, Li; Du, Juan; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun
Showing results 2 to 8 of 8