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Browsing by Author Conway, Paul P.

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Issue DateTitleAuthor(s)
2007Adhesion of precision welded lead-free electrical interconnects formed by molten droplet depositionWebb, D.P.; Liu, C.; Sarvar, Farhad; Conway, Paul P.; Williams, K.
2012The assessment of areal surface texture parameters for characterizing the adhesive bond strength of copper plated micro-machined glass.He, Baofeng; Petzing, Jon N.; Webb, Patrick; Leach, Richard K.; Conway, Paul P.
1997Automated adaptive control of the reflow soldering of electronic assembliesConway, Paul P.; Whalley, David C.; Wilkinson, M.; Williams, David J.
2006A case-based reasoning approach for low volume, high added value electronicsSegura-Velandia, Diana M.; West, Andrew A.; Conway, Paul P.; Whalley, David C.
2008Characterization of printed solder paste excess and bridge related defectsWilson, Antony R.; West, Andrew A.; Segura-Velandia, Diana M.; Conway, Paul P.; Whalley, David C.; Huertas-Quintero, Lina A.M.; Monfared, R.
2007Complex low volume electronics simulation tool to improve yield and reliabilitySegura-Velandia, Diana M.; Conway, Paul P.; West, Andrew A.; Whalley, David C.; Wilson, Antony R.; Huertas-Quintero, Lina A.M.
2008Corrosion characterization of tin-lead and lead free solders in 3.5 wt.% NaCl solutionLi, Dezhi; Conway, Paul P.; Liu, Changqing
2007Crystallographic structure and mechanical behaviour of SnAgCu solder interconnects under a constant loading rateGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2010Design and construction of large-area flexible printed-circuit automotive electrical interconnection harnessesWebb, D.P.; Jaggernauth, W.A.; Cottrill, M.C.W.; Palmer, Paul J.; West, Andrew A.; Conway, Paul P.
2002Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activationHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2002Electroless nickel bumping of aluminium bondpads. Part 2 - electroless nickel platingHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2004Electromagnetic compatibility performance of large area flexible printed circuit automotive harnessWebb, D.P.; Jaggernauth, W.A.; Cottrill, M.C.W.; West, Andrew A.; Conway, Paul P.; Palmer, Paul J.
2011The evolution of Pd/Sn catalytic surfaces in electroless copper depositionCui, Xiaoyun; Hutt, David A.; Scurr, David J.; Conway, Paul P.
2012Excimer laser machining of microvias in glass substrates for the manufacture of high density interconnectsBhatt, Deepa; Hutt, David A.; Conway, Paul P.
2010Fabrication of a polymeric optical waveguide-on-flex using electrostatic-induced lithographyHin, Tze Yang; Liu, Changqing; Conway, Paul P.; Yu, Weixing; Cargill, Scott; Desmulliez, Marc P.Y.
2011Fabrication of polymer waveguides by laser ablation using a 355 nm wavelength Nd:YAG laserZakariyah, Shefiu S.; Conway, Paul P.; Hutt, David A.; Selviah, David; Wang, Kai; Rygate, Jeremy; Calver, Jonathan; Kandulski, Witold
2010Formation of Ag3Sn plates in SnAgCu solder bumpsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2009Formation of Sn dendrites and SnAg eutectics in a SnAgCu solderGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2006Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-jointsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2008Integration issues in the development of a modelling and simulation tool for low volume high-complexity electronics manufactureWest, Andrew A.; Segura-Velandia, Diana M.; Conway, Paul P.; Whalley, David C.; Monfared, R.
Showing results 1 to 20 of 41