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Browsing by Author Conway, Paul P.

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Showing results 15 to 34 of 41
Issue DateTitleAuthor(s)
2010Fabrication of a polymeric optical waveguide-on-flex using electrostatic-induced lithographyHin, Tze Yang; Liu, Changqing; Conway, Paul P.; Yu, Weixing; Cargill, Scott; Desmulliez, Marc P.Y.
2011Fabrication of polymer waveguides by laser ablation using a 355 nm wavelength Nd:YAG laserZakariyah, Shefiu S.; Conway, Paul P.; Hutt, David A.; Selviah, David; Wang, Kai; Rygate, Jeremy; Calver, Jonathan; Kandulski, Witold
2010Formation of Ag3Sn plates in SnAgCu solder bumpsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2009Formation of Sn dendrites and SnAg eutectics in a SnAgCu solderGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2006Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-jointsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2008Integration issues in the development of a modelling and simulation tool for low volume high-complexity electronics manufactureWest, Andrew A.; Segura-Velandia, Diana M.; Conway, Paul P.; Whalley, David C.; Monfared, R.
2008Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnectsLi, Jianfeng; Mannan, Samjid H.; Clode, Mike P.; Chen, Keming; Whalley, David C.; Hutt, David A.; Conway, Paul P.
1999Investigation of a solder bumping technique for flip-chip interconnectionHutt, David A.; Rhodes, Daniel G.; Conway, Paul P.; Mannan, Samjid H.; Whalley, David C.
2010Low frequency induction heating for the sealing of plastic microfluidic systemsKnauf, Benedikt J.; Webb, D.P.; Liu, Changqing; Conway, Paul P.
2007Manufacture of a human mesenchymal stem cell population using an automated cell culture platformThomas, Robert James; Chandra, Amit; Liu, Yang; Hourd, Paul C.; Conway, Paul P.; Williams, David J.
2006Materials and processes issues in fine pitch eutectic solder flip chip interconnectionLiu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C.
2004Materials and processes issues in fine pitch eutectic solder flip chip interconnection.Liu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C.
2006Mechanical behaviour of grains in SnAgCu solder jointsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2008Mesomechanical modelling of SnAgCu solder joints in flip chipGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2000Observations of solder paste reflow by means of electrical measurementsMannan, Samjid H.; Hutt, David A.; Whalley, David C.; Conway, Paul P.
2009Packaging of microfluidic devices for fluid interconnection using thermoplasticsWebb, D.P.; Hutt, David A.; Hopkinson, Neil; Conway, Paul P.; Palmer, Paul J.
2009Polymer optical waveguide fabrication using laser ablationZakariyah, Shefiu S.; Conway, Paul P.; Hutt, David A.; Selviah, David; Wang, Kai; Baghsiahi, Hadi; Rygate, Jeremy; Calver, Jonathan; Kandulski, Witold
1991A process model of the infra-red reflow soldering of printed circuit board assembliesWhalley, David C.; Ogunjimi, Adebayo Oluyinka; Conway, Paul P.; Williams, David J.
1990Process variables in the reflow soldering of surface mountConway, Paul P.; Williams, David J.; Tang, A.C.T.; Sargent, P.M.; Whalley, David C.
2009Productionisation issues for commercialisation of microfluidic based devicesWebb, D.P.; Knauf, Benedikt J.; Liu, Changqing; Hutt, David A.; Conway, Paul P.
Showing results 15 to 34 of 41