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Browsing by Author Conway, Paul P.

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Showing results 36 to 55 of 75
Issue DateTitleAuthor(s)
2017Hybrid ToF and RSSI real-time semantic tracking with an adaptive industrial internet of things architecturePease, Sarogini G.; Conway, Paul P.; West, Andrew A.
2016Industrie 4.0 implementations in the automotive industrySegura-Velandia, Diana M.; Neal, Aaron; Goodall, Paul A.; Conway, Paul P.; West, Andrew A.
2008Integration issues in the development of a modelling and simulation tool for low volume high-complexity electronics manufactureWest, Andrew A.; Segura-Velandia, Diana M.; Conway, Paul P.; Whalley, David C.; Monfared, Radmehr P.
2017An intelligent real-time cyber-physical toolset for energy and process prediction and optimisation in the future industrial internet of thingsPease, Sarogini G.; Trueman, Russell; Davies, Callum; Grosberg, Jude; Yau, Kai Hin; Kaur, Navjot; Conway, Paul P.; West, Andrew A.
2008Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnectsLi, Jianfeng; Mannan, Samjid H.; Clode, Mike P.; Chen, Keming; Whalley, David C.; Hutt, David A.; Conway, Paul P.
1999Investigation of a solder bumping technique for flip-chip interconnectionHutt, David A.; Rhodes, Daniel G.; Conway, Paul P.; Mannan, Samjid H.; Whalley, David C.
2010Low frequency induction heating for the sealing of plastic microfluidic systemsKnauf, Benedikt J.; Webb, D. Patrick; Liu, Changqing; Conway, Paul P.
2007Manufacture of a human mesenchymal stem cell population using an automated cell culture platformThomas, Robert James; Chandra, Amit; Liu, Yang; Hourd, Paul C.; Conway, Paul P.; Williams, David J.
2006Materials and processes issues in fine pitch eutectic solder flip chip interconnectionLiu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C.
2004Materials and processes issues in fine pitch eutectic solder flip chip interconnectionLiu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C.
2017Materials and processing of TSVKumar, Praveen; Dutta, Indranath; Huang, Zhiheng; Conway, Paul P.
2016A materials genome approach for heterogeneous integration [Abstract]Huang, Zhiheng; Liu, Jinxin; Conway, Paul P.; Liu, Yang [Sun Yat-sen University]
2015Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditionsMirgkizoudi, Maria; Liu, Changqing; Conway, Paul P.; Riches, Steve
2006Mechanical behaviour of grains in SnAgCu solder jointsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2008Mesomechanical modelling of SnAgCu solder joints in flip chipGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2013A method for quantification of the effects of size and geometry on the microstructure of miniature interconnectsXiong, Hua; Huang, Zhiheng; Conway, Paul P.
2017Microstructural and reliability issues of TSVKumar, Praveen; Dutta, Indranath; Huang, Zhiheng; Conway, Paul P.
2014Microstructure-based multiphysics modeling for semiconductor integration and packagingHuang, Zhiheng; Xiong, Hua; Wu, Zhiyong; Conway, Paul P.; Davies, Hugh; Dinsdale, Alan; En, Yunfei; Zeng, Qingfeng
2014Model based automated cycling ergometerChakravorti, Nandini; Lugo, Heinz; Philpott, Lydia K.; Conway, Paul P.; West, Andrew A.
2013Multiscale microstructures and microstructural effects on the reliability of microbumps in three-dimensional integrationHuang, Zhiheng; Xiong, Hua; Wu, Zhiyong; Conway, Paul P.; Altmann, Frank
Showing results 36 to 55 of 75