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Browsing by Author Conway, Paul P.
Showing results 30 to 42 of 42
| Issue Date | Title | Author(s) | | 2000 | Observations of solder paste reflow by means of electrical measurements | Mannan, Samjid H.; Hutt, David A.; Whalley, David C.; Conway, Paul P. |
| 2009 | Packaging of microfluidic devices for fluid interconnection using thermoplastics | Webb, D.P.; Hutt, David A.; Hopkinson, Neil; Conway, Paul P.; Palmer, Paul J. |
| 2009 | Polymer optical waveguide fabrication using laser ablation | Zakariyah, Shefiu S.; Conway, Paul P.; Hutt, David A.; Selviah, David; Wang, Kai; Baghsiahi, Hadi; Rygate, Jeremy; Calver, Jonathan; Kandulski, Witold |
| 1991 | A process model of the infra-red reflow soldering of printed circuit board assemblies | Whalley, David C.; Ogunjimi, Adebayo Oluyinka; Conway, Paul P.; Williams, David J. |
| 1990 | Process variables in the reflow soldering of surface mount | Conway, Paul P.; Williams, David J.; Tang, A.C.T.; Sargent, P.M.; Whalley, David C. |
| 2009 | Productionisation issues for commercialisation of microfluidic based devices | Webb, D.P.; Knauf, Benedikt J.; Liu, Changqing; Hutt, David A.; Conway, Paul P. |
| 2012 | Product life cycle information management in the electronics supply chain | Bindel, Axel; Rosamond, E.L.; Conway, Paul P.; West, Andrew A. |
| 2000 | Scanning acoustic microscopy investigation of engineered flip-chip delamination | Hutt, David A.; Whalley, David C.; Webb, D.P.; Hung, K.C.; Tang, C.W.; Conway, Paul P.; Chan, U.C. |
| 2008 | A simulation module for supporting the manufacture of high value added electronics manufacturing | West, Andrew A.; Huertas-Quintero, Lina A.M.; Segura-Velandia, Diana M.; Conway, Paul P.; Whalley, David C.; Wilson, Antony R.; Monfared, R. |
| 2000 | Solder paste reflow modeling for flip chip assembly | Mannan, Samjid H.; Wheeler, D.; Hutt, David A.; Whalley, David C.; Conway, Paul P.; Bailey, Chris |
| 2006 | Thermal interface materials - a review of the state of the art | Sarvar, Farhad; Whalley, David C.; Conway, Paul P. |
| 2000 | Under bump metallisation of fine pitch flip-chip using electroless nickel deposition | Liu, Changqing; Hutt, David A.; Whalley, David C.; Conway, Paul P.; Mannan, Samjid H. |
| 2012 | The use of areal surface texture parameters to characterize the mechanical bond strength of copper on glass plating applications | He, Baofeng; Petzing, Jon N.; Conway, Paul P.; Webb, Patrick; Leach, Richard K. |
Showing results 30 to 42 of 42
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