Loughborough University
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Loughborough University Institutional Repository

Browsing by Author Conway, Paul P.

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Showing results 27 to 46 of 46
Issue DateTitleAuthor(s)
2004Materials and processes issues in fine pitch eutectic solder flip chip interconnection.Liu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C.
2015Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditionsMirgkizoudi, Maria; Liu, Changqing; Conway, Paul P.; Riches, Steve
2006Mechanical behaviour of grains in SnAgCu solder jointsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2008Mesomechanical modelling of SnAgCu solder joints in flip chipGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2014Microstructure-based multiphysics modeling for semiconductor integration and packagingHuang, Zhiheng; Xiong, Hua; Wu, Zhiyong; Conway, Paul P.; Davies, Hugh; Dinsdale, Alan; En, Yunfei; Zeng, Qingfeng
2000Observations of solder paste reflow by means of electrical measurementsMannan, Samjid H.; Hutt, David A.; Whalley, David C.; Conway, Paul P.
2015On-chip single cell funneling operated by microfabricated thermo-responsive hydrogel layersSantaniello, Tommaso; Yan, Yunsong; Tocchio, Alessandro; Martello, Federico; Gassa, Federico; Webb, Patrick; Zhao, Weiwei; Tamplenizza, Margherita; Schulte, Carsten; Liu, Yang; Hutt, David A.; Milani, Paolo; Conway, Paul P.; Lenardi, Cristina
2009Packaging of microfluidic devices for fluid interconnection using thermoplasticsWebb, D.P.; Hutt, David A.; Hopkinson, Neil; Conway, Paul P.; Palmer, Paul J.
2009Polymer optical waveguide fabrication using laser ablationZakariyah, Shefiu S.; Conway, Paul P.; Hutt, David A.; Selviah, David; Wang, Kai; Baghsiahi, Hadi; Rygate, Jeremy; Calver, Jonathan; Kandulski, Witold
1991A process model of the infra-red reflow soldering of printed circuit board assembliesWhalley, David C.; Ogunjimi, Adebayo Oluyinka; Conway, Paul P.; Williams, David J.
1990Process variables in the reflow soldering of surface mountConway, Paul P.; Williams, David J.; Tang, A.C.T.; Sargent, P.M.; Whalley, David C.
2009Productionisation issues for commercialisation of microfluidic based devicesWebb, D.P.; Knauf, Benedikt J.; Liu, Changqing; Hutt, David A.; Conway, Paul P.
2012Product life cycle information management in the electronics supply chainBindel, Axel; Rosamond, Emma L.; Conway, Paul P.; West, Andrew A.
2014Quantitative characterisation of multi scale microstructures in interconnects for multi-chip stackingHuang, Zhiheng; Conway, Paul P.
2000Scanning acoustic microscopy investigation of engineered flip-chip delaminationHutt, David A.; Whalley, David C.; Webb, D.P.; Hung, K.C.; Tang, C.W.; Conway, Paul P.; Chan, U.C.
2008A simulation module for supporting the manufacture of high value added electronics manufacturingWest, Andrew A.; Huertas-Quintero, Lina A.M.; Segura-Velandia, Diana M.; Conway, Paul P.; Whalley, David C.; Wilson, Antony R.; Monfared, R.
2000Solder paste reflow modeling for flip chip assemblyMannan, Samjid H.; Wheeler, D.; Hutt, David A.; Whalley, David C.; Conway, Paul P.; Bailey, Chris
2006Thermal interface materials - a review of the state of the artSarvar, Farhad; Whalley, David C.; Conway, Paul P.
2000Under bump metallisation of fine pitch flip-chip using electroless nickel depositionLiu, Changqing; Hutt, David A.; Whalley, David C.; Conway, Paul P.; Mannan, Samjid H.
2012The use of areal surface texture parameters to characterize the mechanical bond strength of copper on glass plating applicationsHe, Baofeng; Petzing, Jon N.; Conway, Paul P.; Webb, Patrick; Leach, Richard K.
Showing results 27 to 46 of 46