Loughborough University
Leicestershire, UK
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Loughborough University

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Browsing by Author Gong, Jicheng

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Issue DateTitleAuthor(s)
2006Mechanical behaviour of grains in SnAgCu solder jointsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2008Mesomechanical modelling of SnAgCu solder joints in flip chipGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2007Microstructural features and mechanical behaviour of lead free solders for microelectronic packagingGong, Jicheng
Showing results 5 to 7 of 7