Loughborough University
Leicestershire, UK
LE11 3TU
+44 (0)1509 263171
Loughborough University

Loughborough University Institutional Repository

Browsing by Author Hutt, David A.

Jump to: 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
or enter first few letters:   
Sort by: In order: Results/Page Authors/Record:
Showing results 4 to 23 of 28
Issue DateTitleAuthor(s)
1999Electrical method of monitoring percolation and abrasion of conducting spheres due to shear flow of a dense suspension in a narrow gapMannan, Samjid H.; Hutt, David A.; Whalley, David C.
2002Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activationHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2002Electroless nickel bumping of aluminium bondpads. Part 2 - electroless nickel platingHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2006Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnectsChen, Keming; Liu, Changqing; Whalley, David C.; Hutt, David A.; Li, Jianfeng; Mannan, Samjid H.
2011The evolution of Pd/Sn catalytic surfaces in electroless copper depositionCui, Xiaoyun; Hutt, David A.; Scurr, David J.; Conway, Paul P.
2012Excimer laser machining of microvias in glass substrates for the manufacture of high density interconnectsBhatt, Deepa; Hutt, David A.; Conway, Paul P.
2011Fabrication of polymer waveguides by laser ablation using a 355 nm wavelength Nd:YAG laserZakariyah, Shefiu S.; Conway, Paul P.; Hutt, David A.; Selviah, David; Wang, Kai; Rygate, Jeremy; Calver, Jonathan; Kandulski, Witold
2007Failure mechanisms of dummy IGBT assembles constructed using liquid in-Sn/Nb systemLi, Jianfeng; Sarvar, Farhad; Whalley, David C.; Hutt, David A.; Clode, Mike P.; Mannan, Samjid H.
2008Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnectsLi, Jianfeng; Mannan, Samjid H.; Clode, Mike P.; Chen, Keming; Whalley, David C.; Hutt, David A.; Conway, Paul P.
1999Investigation of a solder bumping technique for flip-chip interconnectionHutt, David A.; Rhodes, Daniel G.; Conway, Paul P.; Mannan, Samjid H.; Whalley, David C.
2006Materials and processes issues in fine pitch eutectic solder flip chip interconnectionLiu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C.
2004Materials and processes issues in fine pitch eutectic solder flip chip interconnection.Liu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C.
2006Modeling of the power cycling performance of a Si on Si flip chip assemblyOchana, Andrew R.; Hutt, David A.; Whalley, David C.; Sarvar, Farhad; Al-Habaibeh, A.
2000Observations of solder paste reflow by means of electrical measurementsMannan, Samjid H.; Hutt, David A.; Whalley, David C.; Conway, Paul P.
2005Overmoulding of electronics for end of life recoveryHutt, David A.; Teh, Nee Joo; Sarvar, Farhad; Whalley, David C.; Palmer, Paul J.; Anderson, Paul; Kandasubramanian, Bala; Morris, Peter; Prosser, Stephen; O'Brien, Phillip
2009Packaging of microfluidic devices for fluid interconnection using thermoplasticsWebb, D.P.; Hutt, David A.; Hopkinson, Neil; Conway, Paul P.; Palmer, Paul J.
2009Polymer optical waveguide fabrication using laser ablationZakariyah, Shefiu S.; Conway, Paul P.; Hutt, David A.; Selviah, David; Wang, Kai; Baghsiahi, Hadi; Rygate, Jeremy; Calver, Jonathan; Kandulski, Witold
2009Productionisation issues for commercialisation of microfluidic based devicesWebb, D.P.; Knauf, Benedikt J.; Liu, Changqing; Hutt, David A.; Conway, Paul P.
2000Scanning acoustic microscopy investigation of engineered flip-chip delaminationHutt, David A.; Whalley, David C.; Webb, D.P.; Hung, K.C.; Tang, C.W.; Conway, Paul P.; Chan, U.C.
2000Solder paste reflow modeling for flip chip assemblyMannan, Samjid H.; Wheeler, D.; Hutt, David A.; Whalley, David C.; Conway, Paul P.; Bailey, Chris
Showing results 4 to 23 of 28