Loughborough University
Leicestershire, UK
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Loughborough University

Loughborough University Institutional Repository

Browsing by Author Hutt, David A.

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Issue DateTitleAuthor(s)
2009Packaging of microfluidic devices for fluid interconnection using thermoplasticsWebb, D.P.; Hutt, David A.; Hopkinson, Neil; Conway, Paul P.; Palmer, Paul J.
2009Polymer optical waveguide fabrication using laser ablationZakariyah, Shefiu S.; Conway, Paul P.; Hutt, David A.; Selviah, David; Wang, Kai; Baghsiahi, Hadi; Rygate, Jeremy; Calver, Jonathan; Kandulski, Witold
2009Productionisation issues for commercialisation of microfluidic based devicesWebb, D.P.; Knauf, Benedikt J.; Liu, Changqing; Hutt, David A.; Conway, Paul P.
2000Scanning acoustic microscopy investigation of engineered flip-chip delaminationHutt, David A.; Whalley, David C.; Webb, D.P.; Hung, K.C.; Tang, C.W.; Conway, Paul P.; Chan, U.C.
2000Solder paste reflow modeling for flip chip assemblyMannan, Samjid H.; Wheeler, D.; Hutt, David A.; Whalley, David C.; Conway, Paul P.; Bailey, Chris
2005Stability of Ni3P and its effect on the interfacial reaction between electroless Ni-P and molten tinChen, Keming; Liu, Changqing; Whalley, David C.; Hutt, David A.
2008A substrateless process for sustainable manufacture of electronic assembliesWebb, D.P.; Hutt, David A.; Whalley, David C.; Palmer, Paul J.
2010The thermal stability of alkanethiol self-assembled monolayers on copper for fluxless soldering applicationsEbbens, Stephen; Hutt, David A.; Liu, Changqing
2004Thermo-mechanical modelling of polymer encapsulated electronicsSarvar, Farhad; Teh, Nee Joo; Whalley, David C.; Hutt, David A.; Palmer, Paul J.
2000Under bump metallisation of fine pitch flip-chip using electroless nickel depositionLiu, Changqing; Hutt, David A.; Whalley, David C.; Conway, Paul P.; Mannan, Samjid H.
Showing results 19 to 28 of 28