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Browsing by Author Liu, Changqing
Showing results 21 to 40 of 84
| Issue Date | Title | Author(s) | | 2008 | Effects of process parameters on bondability in thermosonic copper ball bonding | Xu, Hui; Liu, Changqing; Silberschmidt, Vadim V.; Wang, Honghui |
| 2004 | Electrical conduction characteristics of solid metal anisotropic conductive adhesive particles | Dou, Guangbin; Whalley, David C.; Liu, Changqing |
| 2004 | Electrical conductive, characteristics of ACA bonding: a review of the literature, current challenges and future prospects. | Dou, Guangbin; Whalley, David C.; Liu, Changqing |
| 2012 | Electrically conductive adhesive enable to manufacture high performance patch probe for non-invasive physiological assessment | Zhang, Xiaolong; Hu, Sijung; Liu, Changqing; Azorin-Peris, Vicente; Imms, Ryan |
| 2011 | Electrical properties of an isotropic conductive adhesive filled with silver coated polymer spheres | Jain, Shiwani; Whalley, David C.; Cottrill, M.C.W.; Kristiansen, H.; Redford, K.; Nilsen, C.B.; Helland, T.; Liu, Changqing |
| 2014 | Electrodeposition and characterisation of novel Ni-NbOx composite coatings from glycol-based electrolytes as a diffusion barrier for high temperature electronics packaging | Wang, Jing; Wilcox, G.D.; Mortimer, Roger J.; Liu, Changqing; Ashworth, Mark A. |
| 2014 | Electrodeposition and characterization of nanocrystalline Ni-NbOx composite coatings from glycol-based electrolytes for high temperature electronics packaging | Wang, Jing; Wilcox, G.D.; Mortimer, Roger J.; Liu, Changqing; Ashworth, Mark A. |
| 2002 | Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activation | Hutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H. |
| 2002 | Electroless nickel bumping of aluminium bondpads. Part 2 - electroless nickel plating | Hutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H. |
| 2006 | Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnects | Chen, Keming; Liu, Changqing; Whalley, David C.; Hutt, David A.; Li, Jianfeng; Mannan, Samjid H. |
| 2010 | Epoxy adhesive behaviour on ceramic surfaces in commercial optoelectronic assemblies | Williams, Owain; Liu, Changqing; Webb, D. Patrick; Firth, P. |
| 2016 | Fabrication and characterisation of 3D complex hydroxyapatite scaffolds with hierarchical porosity of different features for optimal bioactive performance | Chen, Zhichao; Zhang, Xianglin; Yang, Yang; Zhou, Kui; Wragg, Nicholas M.; Liu, Yang; Lewis, Mark P.; Liu, Changqing |
| 2010 | Fabrication of a polymeric optical waveguide-on-flex using electrostatic-induced lithography | Hin, Tze Yang; Liu, Changqing; Conway, Paul P.; Yu, Weixing; Cargill, Scott; Desmulliez, Marc P.Y. |
| 2013 | Fine pitch printing on a non-woven fabric for high frequency applications | Lim, Ying Ying; Goh, Yee M.; Liu, Changqing |
| 2010 | Formation of Ag3Sn plates in SnAgCu solder bumps | Gong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V. |
| 2009 | Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder | Gong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V. |
| 2016 | Fracture behaviour of bacterial cellulose hydrogel: Microstructural effect | Gao, Xing; Shi, Zhijun; Liu, Changqing; Yang, Guang; Silberschmidt, Vadim V. |
| 2006 | Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-joints | Gong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V. |
| 2013 | The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers | Zhang, Yan; Liu, Changqing; Whalley, David C. |
| 2015 | Inelastic behaviour of bacterial cellulose hydrogel: in aqua cyclic tests | Gao, Xing; Shi, Z.; Liu, Changqing; Yang, Guang; Sevostianov, Igor; Silberschmidt, Vadim V. |
Showing results 21 to 40 of 84
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