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Browsing by Author Liu, Changqing

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Showing results 21 to 40 of 83
Issue DateTitleAuthor(s)
2004Electrical conduction characteristics of solid metal anisotropic conductive adhesive particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2004Electrical conductive, characteristics of ACA bonding: a review of the literature, current challenges and future prospects.Dou, Guangbin; Whalley, David C.; Liu, Changqing
2012Electrically conductive adhesive enable to manufacture high performance patch probe for non-invasive physiological assessmentZhang, Xiaolong; Hu, Sijung; Liu, Changqing; Azorin-Peris, Vicente; Imms, Ryan
2011Electrical properties of an isotropic conductive adhesive filled with silver coated polymer spheresJain, Shiwani; Whalley, David C.; Cottrill, M.C.W.; Kristiansen, H.; Redford, K.; Nilsen, C.B.; Helland, T.; Liu, Changqing
2014Electrodeposition and characterisation of novel Ni-NbOx composite coatings from glycol-based electrolytes as a diffusion barrier for high temperature electronics packagingWang, Jing; Wilcox, G.D.; Mortimer, Roger J.; Liu, Changqing; Ashworth, Mark A.
2014Electrodeposition and characterization of nanocrystalline Ni-NbOx composite coatings from glycol-based electrolytes for high temperature electronics packagingWang, Jing; Wilcox, G.D.; Mortimer, Roger J.; Liu, Changqing; Ashworth, Mark A.
2002Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activationHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2002Electroless nickel bumping of aluminium bondpads. Part 2 - electroless nickel platingHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2006Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnectsChen, Keming; Liu, Changqing; Whalley, David C.; Hutt, David A.; Li, Jianfeng; Mannan, Samjid H.
2010Epoxy adhesive behaviour on ceramic surfaces in commercial optoelectronic assembliesWilliams, Owain; Liu, Changqing; Webb, D.P.; Firth, P.
2017Fabrication and characterisation of 3D complex hydroxyapatite scaffolds with hierarchical porosity of different features for optimal bioactive performanceChen, Zhichao; Zhang, Xianglin; Yang, Yang; Zhou, Kui; Wragg, Nicholas M.; Liu, Yang; Lewis, Mark P.; Liu, Changqing
2010Fabrication of a polymeric optical waveguide-on-flex using electrostatic-induced lithographyHin, Tze Yang; Liu, Changqing; Conway, Paul P.; Yu, Weixing; Cargill, Scott; Desmulliez, Marc P.Y.
2013Fine pitch printing on a non-woven fabric for high frequency applicationsLim, Ying Ying; Goh, Yee M.; Liu, Changqing
2010Formation of Ag3Sn plates in SnAgCu solder bumpsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2009Formation of Sn dendrites and SnAg eutectics in a SnAgCu solderGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2016Fracture behaviour of bacterial cellulose hydrogel: Microstructural effectGao, Xing; Shi, Zhijun; Liu, Changqing; Yang, Guang; Silberschmidt, Vadim V.
2006Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-jointsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2013The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layersZhang, Yan; Liu, Changqing; Whalley, David C.
2015Inelastic behaviour of bacterial cellulose hydrogel: in aqua cyclic testsGao, Xing; Shi, Z.; Liu, Changqing; Yang, Guang; Sevostianov, Igor; Silberschmidt, Vadim V.
2012Influence of etching solvent evaporation on the size of micro-via holes in PVP thin filmsZhang, Yan; Liu, Changqing; Whalley, David C.
Showing results 21 to 40 of 83