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Browsing by Author Liu, Changqing
Showing results 21 to 39 of 39
| Issue Date | Title | Author(s) | | 2012 | Influence of etching solvent evaporation on the size of micro-via holes in PVP thin films | Zhang, Yan; Liu, Changqing; Whalley, David C. |
| 2005 | Interactions between liquid Sn-Bi based solders and contact metals for high temperature applications | Li, Jianfeng; Mannan, Samjid H.; Clode, Mike P.; Lobato, H.M.; Liu, Changqing; Whalley, David C.; Lawrence, F.T.; Jackson, G.; Steen, H. |
| 2010 | Low frequency induction heating for the sealing of plastic microfluidic systems | Knauf, Benedikt J.; Webb, D.P.; Liu, Changqing; Conway, Paul P. |
| 2006 | Materials and processes issues in fine pitch eutectic solder flip chip interconnection | Liu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C. |
| 2004 | Materials and processes issues in fine pitch eutectic solder flip chip interconnection. | Liu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C. |
| 2006 | Mechanical and electrical characterisation of individual ACA conductor particles | Dou, Guangbin; Whalley, David C.; Liu, Changqing |
| 2006 | Mechanical behaviour of grains in SnAgCu solder joints | Gong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V. |
| 2008 | Mechanical characterization of individual Ni/Au coated microsize polymer particles | Dou, Guangbin; Whalley, David C.; Liu, Changqing |
| 2009 | Mechanical response of indium micro-joints to low temperature cycling | Cheng, X.; Liu, Changqing; Silberschmidt, Vadim V. |
| 2008 | Mesomechanical modelling of SnAgCu solder joints in flip chip | Gong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V. |
| 2012 | Numerical analysis of thermo-mechanical behavior of indium micro-joint at cryogenic temperatures | Cheng, X.; Liu, Changqing; Silberschmidt, Vadim V. |
| 2012 | On the use of silver nanoparticles for direct micropatterning on polyimide substrates | Ng, Jack H.-G.; Watson, David E.G.; Sigwarth, Joachim; McCarthy, Aongus; Prior, Kevin A.; Hand, Duncan P.; Yu, Weixing; Kay, Robert W.; Liu, Changqing; Desmulliez, Marc P.Y. |
| 2012 | The penetration limit of poly(4-vinyl phenol) thin films for etching via holes by inkjet printing | Zhang, Yan; Liu, Changqing; Whalley, David C. |
| 2009 | Productionisation issues for commercialisation of microfluidic based devices | Webb, D.P.; Knauf, Benedikt J.; Liu, Changqing; Hutt, David A.; Conway, Paul P. |
| 2005 | Stability of Ni3P and its effect on the interfacial reaction between electroless Ni-P and molten tin | Chen, Keming; Liu, Changqing; Whalley, David C.; Hutt, David A. |
| 2013 | Surface treatments for inkjet printing onto a PTFE-based substrate for high frequency applications | Lim, Ying Ying; Goh, Yee M.; Liu, Changqing |
| 2008 | TEM microstructural analysis of as-bonded copper ball bonds on aluminum metallization | Xu, Hui; Liu, Changqing; Silberschmidt, Vadim V.; Chen, Zhong |
| 2010 | The thermal stability of alkanethiol self-assembled monolayers on copper for fluxless soldering applications | Ebbens, Stephen; Hutt, David A.; Liu, Changqing |
| 2000 | Under bump metallisation of fine pitch flip-chip using electroless nickel deposition | Liu, Changqing; Hutt, David A.; Whalley, David C.; Conway, Paul P.; Mannan, Samjid H. |
Showing results 21 to 39 of 39
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