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Browsing by Author Liu, Changqing
Showing results 21 to 40 of 78
| Issue Date | Title | Author(s) | | 2012 | Electrically conductive adhesive enable to manufacture high performance patch probe for non-invasive physiological assessment | Zhang, Xiaolong; Hu, Sijung; Liu, Changqing; Azorin-Peris, Vicente; Imms, Ryan |
| 2011 | Electrical properties of an isotropic conductive adhesive filled with silver coated polymer spheres | Jain, Shiwani; Whalley, David C.; Cottrill, M.C.W.; Kristiansen, H.; Redford, K.; Nilsen, C.B.; Helland, T.; Liu, Changqing |
| 2014 | Electrodeposition and characterisation of novel Ni-NbOx composite coatings from glycol-based electrolytes as a diffusion barrier for high temperature electronics packaging | Wang, Jing; Wilcox, G.D.; Mortimer, Roger J.; Liu, Changqing; Ashworth, Mark A. |
| 2014 | Electrodeposition and characterization of nanocrystalline Ni-NbOx composite coatings from glycol-based electrolytes for high temperature electronics packaging | Wang, Jing; Wilcox, G.D.; Mortimer, Roger J.; Liu, Changqing; Ashworth, Mark A. |
| 2002 | Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activation | Hutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H. |
| 2002 | Electroless nickel bumping of aluminium bondpads. Part 2 - electroless nickel plating | Hutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H. |
| 2006 | Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnects | Chen, Keming; Liu, Changqing; Whalley, David C.; Hutt, David A.; Li, Jianfeng; Mannan, Samjid H. |
| 2010 | Epoxy adhesive behaviour on ceramic surfaces in commercial optoelectronic assemblies | Williams, Owain; Liu, Changqing; Webb, D.P.; Firth, P. |
| 2010 | Fabrication of a polymeric optical waveguide-on-flex using electrostatic-induced lithography | Hin, Tze Yang; Liu, Changqing; Conway, Paul P.; Yu, Weixing; Cargill, Scott; Desmulliez, Marc P.Y. |
| 2013 | Fine pitch printing on a non-woven fabric for high frequency applications | Lim, Ying Ying; Goh, Yee M.; Liu, Changqing |
| 2010 | Formation of Ag3Sn plates in SnAgCu solder bumps | Gong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V. |
| 2009 | Formation of Sn dendrites and SnAg eutectics in a SnAgCu solder | Gong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V. |
| 2006 | Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-joints | Gong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V. |
| 2013 | The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers | Zhang, Yan; Liu, Changqing; Whalley, David C. |
| 2015 | Inelastic behaviour of bacterial cellulose hydrogel: in aqua cyclic tests | Gao, Xing; Shi, Z.; Liu, Changqing; Yang, Guang; Sevostianov, Igor; Silberschmidt, Vadim V. |
| 2012 | Influence of etching solvent evaporation on the size of micro-via holes in PVP thin films | Zhang, Yan; Liu, Changqing; Whalley, David C. |
| 2005 | Interactions between liquid Sn-Bi based solders and contact metals for high temperature applications | Li, Jianfeng; Mannan, Samjid H.; Clode, Mike P.; Lobato, H.M.; Liu, Changqing; Whalley, David C.; Lawrence, F.T.; Jackson, G.; Steen, H. |
| 2014 | An investigation into zinc diffusion and tin whisker growth for electroplated tin deposits on brass | Ashworth, Mark A.; Wilcox, G.D.; Higginson, Rebecca L.; Heath, R.J.; Liu, Changqing |
| 2010 | Low frequency induction heating for the sealing of plastic microfluidic systems | Knauf, Benedikt J.; Webb, D.P.; Liu, Changqing; Conway, Paul P. |
| 2014 | Magnetic deposition of Ni/Au coated polymer core particles for flip-chip interconnection | Tao, Junlei; Whalley, David C.; Liu, Changqing |
Showing results 21 to 40 of 78
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