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Browsing by Author Liu, Changqing

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Showing results 21 to 40 of 46
Issue DateTitleAuthor(s)
2006Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-jointsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2013The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layersZhang, Yan; Liu, Changqing; Whalley, David C.
2012Influence of etching solvent evaporation on the size of micro-via holes in PVP thin filmsZhang, Yan; Liu, Changqing; Whalley, David C.
2005Interactions between liquid Sn-Bi based solders and contact metals for high temperature applicationsLi, Jianfeng; Mannan, Samjid H.; Clode, Mike P.; Lobato, H.M.; Liu, Changqing; Whalley, David C.; Lawrence, F.T.; Jackson, G.; Steen, H.
2014An investigation into zinc diffusion and tin whisker growth for electroplated tin deposits on brassAshworth, M.A.; Wilcox, G.D.; Higginson, Rebecca L.; Heath, R.J.; Liu, Changqing
2010Low frequency induction heating for the sealing of plastic microfluidic systemsKnauf, Benedikt J.; Webb, D.P.; Liu, Changqing; Conway, Paul P.
2006Materials and processes issues in fine pitch eutectic solder flip chip interconnectionLiu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C.
2004Materials and processes issues in fine pitch eutectic solder flip chip interconnection.Liu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C.
2015Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditionsMirgkizoudi, Maria; Liu, Changqing; Conway, Paul P.; Riches, Steve
2006Mechanical and electrical characterisation of individual ACA conductor particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2006Mechanical behaviour of grains in SnAgCu solder jointsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2008Mechanical characterization of individual Ni/Au coated microsize polymer particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2009Mechanical response of indium micro-joints to low temperature cyclingCheng, X.; Liu, Changqing; Silberschmidt, Vadim V.
2008Mesomechanical modelling of SnAgCu solder joints in flip chipGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2015Microstructural and mechanical characteristics of PHEMA-based nanofibre-reinforced hydrogel under compressionZhao, Weiwei; Shi, Zhijun; Chen, Xiuli; Yang, Guang; Lenardi, Cristina; Liu, Changqing
2012Numerical analysis of thermo-mechanical behavior of indium micro-joint at cryogenic temperaturesCheng, X.; Liu, Changqing; Silberschmidt, Vadim V.
2012On the use of silver nanoparticles for direct micropatterning on polyimide substratesNg, Jack H.-G.; Watson, David E.G.; Sigwarth, Joachim; McCarthy, Aongus; Prior, Kevin A.; Hand, Duncan P.; Yu, Weixing; Kay, Robert W.; Liu, Changqing; Desmulliez, Marc P.Y.
2012The penetration limit of poly(4-vinyl phenol) thin films for etching via holes by inkjet printingZhang, Yan; Liu, Changqing; Whalley, David C.
2009Productionisation issues for commercialisation of microfluidic based devicesWebb, D.P.; Knauf, Benedikt J.; Liu, Changqing; Hutt, David A.; Conway, Paul P.
2014Silver screen printed transmission lines- influence of substrate porosity on the RF performance and modelling up to 30GHzLim, Ying Ying; Goh, Yee M.; Yoshida, Manuba; Bui, Tung T.; Vincent, Tracy; Aoyagi, Masahiro; Liu, Changqing
Showing results 21 to 40 of 46