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Browsing by Author Liu, Changqing

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Issue DateTitleAuthor(s)
2008A comparative study of the interfacial reaction between electroless Ni-P coatings and molten tinChen, Keming; Liu, Changqing; Whalley, David C.; Hutt, David A.; Li, Jianfeng; Mannan, Samjid H.
2008Corrosion characterization of tin-lead and lead free solders in 3.5 wt.% NaCl solutionLi, Dezhi; Conway, Paul P.; Liu, Changqing
2007Crystallographic structure and mechanical behaviour of SnAgCu solder interconnects under a constant loading rateGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2006Deformation property measurement for single anisotropic conductive adhesive particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2015Diffusion barrier characteristics of Ni-NbOx composite electrodeposits for liquid In-Sn solder interconnectsWang, Jing; Wilcox, G.D.; Mortimer, Roger J.; Liu, Changqing; Ashworth, Mark A.
2009Direct-write techniques for maskless production of microelectronics: a review of current state-of-the-art technologiesZhang, Yan; Liu, Changqing; Whalley, David C.
2006The effect of co-planarity variation on anisotropic conductive adhesive assembliesDou, Guangbin; Whalley, David C.; Liu, Changqing
2013Effect of direct current and pulse plating parameters on tin whisker growth from tin electrodeposits on copper and brass substratesAshworth, Mark A.; Wilcox, G.D.; Higginson, Rebecca L.; Heath, R.J.; Liu, Changqing
2010The effect of droplet ejection frequency on inkjet-etched micro via holesZhang, Yan; Liu, Changqing; Whalley, David C.
2012The effect of droplet ejection frequency on the dimensions of inkjet-etched micro-via holes in poly4(-vinyl phenol) thin filmsZhang, Yan; Liu, Changqing; Whalley, David C.
2015The effect of electroplating parameters and substrate material on tin whisker formationAshworth, Mark A.; Wilcox, G.D.; Higginson, Rebecca L.; Heath, R.J.; Liu, Changqing; Mortimer, Roger J.
2008Effect of thermal aging on interfacial behaviour of copper ball bondsXu, Hui; Liu, Changqing; Silberschmidt, Vadim V.
2015Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solderChen, Guang; Wu, Fengshun; Liu, Changqing; Xia, Weisheng; Liu, Hui
2008Effects of process parameters on bondability in thermosonic copper ball bondingXu, Hui; Liu, Changqing; Silberschmidt, Vadim V.; Wang, Honghui
2004Electrical conduction characteristics of solid metal anisotropic conductive adhesive particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2004Electrical conductive, characteristics of ACA bonding: a review of the literature, current challenges and future prospects.Dou, Guangbin; Whalley, David C.; Liu, Changqing
2011Electrical properties of an isotropic conductive adhesive filled with silver coated polymer spheresJain, S.; Whalley, David C.; Cottrill, M.C.W.; Kristiansen, H.; Redford, K.; Nilsen, C.B.; Helland, T.; Liu, Changqing
2014Electrodeposition and characterisation of novel Ni-NbOx composite coatings from glycol-based electrolytes as a diffusion barrier for high temperature electronics packagingWang, Jing; Wilcox, G.D.; Mortimer, Roger J.; Liu, Changqing; Ashworth, Mark A.
2014Electrodeposition and characterization of nanocrystalline Ni-NbOx composite coatings from glycol-based electrolytes for high temperature electronics packagingWang, Jing; Wilcox, G.D.; Mortimer, Roger J.; Liu, Changqing; Ashworth, Mark A.
2002Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activationHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
Showing results 3 to 22 of 70