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Browsing by Author Liu, Changqing

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Showing results 3 to 22 of 39
Issue DateTitleAuthor(s)
2006Deformation property measurement for single anisotropic conductive adhesive particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2009Direct-write techniques for maskless production of microelectronics: a review of current state-of-the-art technologiesZhang, Yan; Liu, Changqing; Whalley, David C.
2006The effect of co-planarity variation on anisotropic conductive adhesive assembliesDou, Guangbin; Whalley, David C.; Liu, Changqing
2010The effect of droplet ejection frequency on inkjet-etched micro via holesZhang, Yan; Liu, Changqing; Whalley, David C.
2012The effect of droplet ejection frequency on the dimensions of inkjet-etched micro-via holes in poly4(-vinyl phenol) thin filmsZhang, Yan; Liu, Changqing; Whalley, David C.
2008Effect of thermal aging on interfacial behaviour of copper ball bondsXu, Hui; Liu, Changqing; Silberschmidt, Vadim V.
2008Effects of process parameters on bondability in thermosonic copper ball bondingXu, Hui; Liu, Changqing; Silberschmidt, Vadim V.; Wang, Honghui
2004Electrical conduction characteristics of solid metal anisotropic conductive adhesive particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2004Electrical conductive, characteristics of ACA bonding: a review of the literature, current challenges and future prospects.Dou, Guangbin; Whalley, David C.; Liu, Changqing
2002Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activationHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2002Electroless nickel bumping of aluminium bondpads. Part 2 - electroless nickel platingHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2006Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnectsChen, Keming; Liu, Changqing; Whalley, David C.; Hutt, David A.; Li, Jianfeng; Mannan, Samjid H.
2010Fabrication of a polymeric optical waveguide-on-flex using electrostatic-induced lithographyHin, Tze Yang; Liu, Changqing; Conway, Paul P.; Yu, Weixing; Cargill, Scott; Desmulliez, Marc P.Y.
2013Fine pitch printing on a non-woven fabric for high frequency applicationsLim, Ying Ying; Goh, Yee M.; Liu, Changqing
2010Formation of Ag3Sn plates in SnAgCu solder bumpsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2009Formation of Sn dendrites and SnAg eutectics in a SnAgCu solderGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2006Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-jointsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2013The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layersZhang, Yan; Liu, Changqing; Whalley, David C.
2012Influence of etching solvent evaporation on the size of micro-via holes in PVP thin filmsZhang, Yan; Liu, Changqing; Whalley, David C.
2005Interactions between liquid Sn-Bi based solders and contact metals for high temperature applicationsLi, Jianfeng; Mannan, Samjid H.; Clode, Mike P.; Lobato, H.M.; Liu, Changqing; Whalley, David C.; Lawrence, F.T.; Jackson, G.; Steen, H.
Showing results 3 to 22 of 39