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Browsing by Author Liu, Changqing

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Showing results 17 to 36 of 47
Issue DateTitleAuthor(s)
2010Fabrication of a polymeric optical waveguide-on-flex using electrostatic-induced lithographyHin, Tze Yang; Liu, Changqing; Conway, Paul P.; Yu, Weixing; Cargill, Scott; Desmulliez, Marc P.Y.
2013Fine pitch printing on a non-woven fabric for high frequency applicationsLim, Ying Ying; Goh, Yee M.; Liu, Changqing
2010Formation of Ag3Sn plates in SnAgCu solder bumpsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2009Formation of Sn dendrites and SnAg eutectics in a SnAgCu solderGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2006Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-jointsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2013The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layersZhang, Yan; Liu, Changqing; Whalley, David C.
2015Inelastic behaviour of bacterial cellulose hydrogel: in aqua cyclic testsGao, Xing; Shi, Z.; Liu, Changqing; Yang, Guang; Sevostianov, I.; Silberschmidt, Vadim V.
2012Influence of etching solvent evaporation on the size of micro-via holes in PVP thin filmsZhang, Yan; Liu, Changqing; Whalley, David C.
2005Interactions between liquid Sn-Bi based solders and contact metals for high temperature applicationsLi, Jianfeng; Mannan, Samjid H.; Clode, Mike P.; Lobato, H.M.; Liu, Changqing; Whalley, David C.; Lawrence, F.T.; Jackson, G.; Steen, H.
2014An investigation into zinc diffusion and tin whisker growth for electroplated tin deposits on brassAshworth, M.A.; Wilcox, G.D.; Higginson, Rebecca L.; Heath, R.J.; Liu, Changqing
2010Low frequency induction heating for the sealing of plastic microfluidic systemsKnauf, Benedikt J.; Webb, D.P.; Liu, Changqing; Conway, Paul P.
2006Materials and processes issues in fine pitch eutectic solder flip chip interconnectionLiu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C.
2004Materials and processes issues in fine pitch eutectic solder flip chip interconnection.Liu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C.
2015Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditionsMirgkizoudi, Maria; Liu, Changqing; Conway, Paul P.; Riches, Steve
2006Mechanical and electrical characterisation of individual ACA conductor particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2006Mechanical behaviour of grains in SnAgCu solder jointsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2008Mechanical characterization of individual Ni/Au coated microsize polymer particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2009Mechanical response of indium micro-joints to low temperature cyclingCheng, X.; Liu, Changqing; Silberschmidt, Vadim V.
2008Mesomechanical modelling of SnAgCu solder joints in flip chipGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2015Microstructural and mechanical characteristics of PHEMA-based nanofibre-reinforced hydrogel under compressionZhao, Weiwei; Shi, Zhijun; Chen, Xiuli; Yang, Guang; Lenardi, Cristina; Liu, Changqing
Showing results 17 to 36 of 47