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Browsing by Author Liu, Changqing

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Showing results 22 to 41 of 54
Issue DateTitleAuthor(s)
2006Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-jointsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2013The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layersZhang, Yan; Liu, Changqing; Whalley, David C.
2015Inelastic behaviour of bacterial cellulose hydrogel: in aqua cyclic testsGao, Xing; Shi, Z.; Liu, Changqing; Yang, Guang; Sevostianov, I.; Silberschmidt, Vadim V.
2012Influence of etching solvent evaporation on the size of micro-via holes in PVP thin filmsZhang, Yan; Liu, Changqing; Whalley, David C.
2005Interactions between liquid Sn-Bi based solders and contact metals for high temperature applicationsLi, Jianfeng; Mannan, Samjid H.; Clode, Mike P.; Lobato, H.M.; Liu, Changqing; Whalley, David C.; Lawrence, F.T.; Jackson, G.; Steen, H.
2014An investigation into zinc diffusion and tin whisker growth for electroplated tin deposits on brassAshworth, M.A.; Wilcox, G.D.; Higginson, Rebecca L.; Heath, R.J.; Liu, Changqing
2010Low frequency induction heating for the sealing of plastic microfluidic systemsKnauf, Benedikt J.; Webb, D.P.; Liu, Changqing; Conway, Paul P.
2014Magnetic deposition of Ni/Au coated polymer core particles for flip-chip interconnectionTao, Junlei; Whalley, David C.; Liu, Changqing
2006Materials and processes issues in fine pitch eutectic solder flip chip interconnectionLiu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C.
2004Materials and processes issues in fine pitch eutectic solder flip chip interconnection.Liu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C.
2015Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditionsMirgkizoudi, Maria; Liu, Changqing; Conway, Paul P.; Riches, Steve
2006Mechanical and electrical characterisation of individual ACA conductor particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2006Mechanical behaviour of grains in SnAgCu solder jointsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2008Mechanical characterization of individual Ni/Au coated microsize polymer particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2009Mechanical response of indium micro-joints to low temperature cyclingCheng, X.; Liu, Changqing; Silberschmidt, Vadim V.
2008Mesomechanical modelling of SnAgCu solder joints in flip chipGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2015Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal conditionMo, L.; Chen, Z.; Wu, F.; Liu, Changqing
2015Microstructural and mechanical characteristics of PHEMA-based nanofibre-reinforced hydrogel under compressionZhao, Weiwei; Shi, Zhijun; Chen, Xiuli; Yang, Guang; Lenardi, Cristina; Liu, Changqing
2015Microstructural and mechanical characteristics of PHEMA-based nanofibre-reinforced hydrogel under compressionZhao, Weiwei; Shi, Zhijun; Chen, Xiuli; Yang, Guang; Lenardi, Cristina; Liu, Changqing
2014Novel fabrication of hierarchically porous hydroxyapatite scaffolds with refined porosity and suitable strengthChen, Z.C.; Zhang, X.L.; Zhou, K.; Cai, H.; Liu, Changqing
Showing results 22 to 41 of 54