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Browsing by Author Liu, Changqing

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Issue DateTitleAuthor(s)
2014Magnetic deposition of Ni/Au coated polymer core particles for flip-chip interconnectionTao, Junlei; Whalley, David C.; Liu, Changqing
2006Materials and processes issues in fine pitch eutectic solder flip chip interconnectionLiu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C.
2004Materials and processes issues in fine pitch eutectic solder flip chip interconnection.Liu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C.
2015Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditionsMirgkizoudi, Maria; Liu, Changqing; Conway, Paul P.; Riches, Steve
2006Mechanical and electrical characterisation of individual ACA conductor particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2006Mechanical behaviour of grains in SnAgCu solder jointsGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2008Mechanical characterization of individual Ni/Au coated microsize polymer particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2009Mechanical response of indium micro-joints to low temperature cyclingCheng, X.; Liu, Changqing; Silberschmidt, Vadim V.
2015A mechanism of the penetration limit for producing holes in poly(4-vinyl phenol) films by inkjet etchingZhang, Yan; Liu, Changqing; Whalley, David C.
2008Mesomechanical modelling of SnAgCu solder joints in flip chipGong, Jicheng; Liu, Changqing; Conway, Paul P.; Silberschmidt, Vadim V.
2016Micro-mechanical and fracture characteristics of Cu6Sn5 and Cu3Sn intermetallic compounds under micro-cantilever bendingLiu, Li; Chen, Zhiwen; Liu, Changqing; Wu, Yiping; An, Bing
2015Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal conditionMo, L.; Chen, Zhichao; Wu, Fengshun; Liu, Changqing
2015Microstructural and mechanical analysis on Cu–Sn intermetallic micro-joints under isothermal conditionChen, Guang; Wu, Fengshun; Liu, Changqing; Silberschmidt, Vadim V.; Chan, Y.C.
2015Microstructural and mechanical characteristics of PHEMA-based nanofibre-reinforced hydrogel under compressionZhao, Weiwei; Shi, Zhijun; Chen, Xiuli; Yang, Guang; Lenardi, Cristina; Liu, Changqing
2015Microstructural and mechanical characteristics of PHEMA-based nanofibre-reinforced hydrogel under compressionZhao, Weiwei; Shi, Zhijun; Chen, Xiuli; Yang, Guang; Lenardi, Cristina; Liu, Changqing
2016Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheetsChen, Guang; Wu, Fengshun; Liu, Changqing; Silberschmidt, Vadim V.; Chan, Y.C.
2014Novel fabrication of hierarchically porous hydroxyapatite scaffolds with refined porosity and suitable strengthChen, Z.C.; Zhang, X.L.; Zhou, Kui; Cai, H.; Liu, Changqing
2015Novel processes to enable deposition of metal coated polymer micro-spheres for flip-chip interconnectionsTao, Junlei; Whalley, David C.; Liu, Changqing; Wu, Fengshun; Kristiansen, H.
2014A novel yet effective motion artefact reduction method for continuous physiological monitoringAlzahrani, Abdullah; Hu, Sijung; Azorin-Peris, Vicente; Kalawsky, Roy S.; Zhang, Xiaolong; Liu, Changqing
2012Numerical analysis of thermo-mechanical behavior of indium micro-joint at cryogenic temperaturesCheng, X.; Liu, Changqing; Silberschmidt, Vadim V.
Showing results 41 to 60 of 80