Loughborough University
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Browsing by Author Liu, Changqing

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Issue DateTitleAuthor(s)
2012Numerical analysis of thermo-mechanical behavior of indium micro-joint at cryogenic temperaturesCheng, X.; Liu, Changqing; Silberschmidt, Vadim V.
2012On the use of silver nanoparticles for direct micropatterning on polyimide substratesNg, Jack H.-G.; Watson, David E.G.; Sigwarth, Joachim; McCarthy, Aongus; Prior, Kevin A.; Hand, Duncan P.; Yu, Weixing; Kay, Robert W.; Liu, Changqing; Desmulliez, Marc P.Y.
2012The penetration limit of poly(4-vinyl phenol) thin films for etching via holes by inkjet printingZhang, Yan; Liu, Changqing; Whalley, David C.
2009Productionisation issues for commercialisation of microfluidic based devicesWebb, D.P.; Knauf, Benedikt J.; Liu, Changqing; Hutt, David A.; Conway, Paul P.
2014Silver screen printed transmission lines- influence of substrate porosity on the RF performance and modelling up to 30GHzLim, Ying Ying; Goh, Yee M.; Yoshida, Manuba; Bui, Tung T.; Vincent, Tracy; Aoyagi, Masahiro; Liu, Changqing
2005Stability of Ni3P and its effect on the interfacial reaction between electroless Ni-P and molten tinChen, Keming; Liu, Changqing; Whalley, David C.; Hutt, David A.
2015Surface modification of an ambient UV-cured dielectric to realise electrically conducting tracesLim, Ying Ying; Goh, Yee M.; Liu, Changqing; Hutt, David A.
2013Surface treatments for inkjet printing onto a PTFE-based substrate for high frequency applicationsLim, Ying Ying; Goh, Yee M.; Liu, Changqing
2008TEM microstructural analysis of as-bonded copper ball bonds on aluminum metallizationXu, Hui; Liu, Changqing; Silberschmidt, Vadim V.; Chen, Zhong
2010The thermal stability of alkanethiol self-assembled monolayers on copper for fluxless soldering applicationsEbbens, Stephen; Hutt, David A.; Liu, Changqing
2000Under bump metallisation of fine pitch flip-chip using electroless nickel depositionLiu, Changqing; Hutt, David A.; Whalley, David C.; Conway, Paul P.; Mannan, Samjid H.
Showing results 36 to 46 of 46