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Browsing by Author Mannan, Samjid H.

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Showing results 1 to 17 of 17
Issue DateTitleAuthor(s)
1996Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part I - experimentOgunjimi, Adebayo Oluyinka; Mannan, Samjid H.; Whalley, David C.; Williams, David J.
1996Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part II - theoryMannan, Samjid H.; Whalley, David C.; Ogunjimi, Adebayo Oluyinka; Williams, David J.
2008A comparative study of the interfacial reaction between electroless Ni-P coatings and molten tinChen, Keming; Liu, C.C.; Whalley, David C.; Hutt, David A.; Li, Jianfeng; Mannan, Samjid H.
1998Conduction mechanisms in anisotropic conducting adhesive assemblyOguibe, Chucks N.; Mannan, Samjid H.; Whalley, David C.; Williams, David J.
1997The effect of temperature ramp rate on flip-chip joint quality and reliability using anisotropically conductive adhesive on FR-4 substrateGustafsson, Katrin; Mannan, Samjid H.; Lai, Zonghe; Liu, Johan; Whalley, David C.; Williams, David J.
1999Electrical method of monitoring percolation and abrasion of conducting spheres due to shear flow of a dense suspension in a narrow gapMannan, Samjid H.; Hutt, David A.; Whalley, David C.
2002Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activationHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2002Electroless nickel bumping of aluminium bondpads. Part 2 - electroless nickel platingHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2006Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnectsChen, Keming; Liu, Changqing; Whalley, David C.; Hutt, David A.; Li, Jianfeng; Mannan, Samjid H.
2007Failure mechanisms of dummy IGBT assembles constructed using liquid in-Sn/Nb systemLi, Jianfeng; Sarvar, Farhad; Whalley, David C.; Hutt, David A.; Clode, Mike P.; Mannan, Samjid H.
2005Interactions between liquid Sn-Bi based solders and contact metals for high temperature applicationsLi, Jianfeng; Mannan, Samjid H.; Clode, Mike P.; Lobato, H.M.; Liu, Changqing; Whalley, David C.; Lawrence, F.T.; Jackson, G.; Steen, H.
2008Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnectsLi, Jianfeng; Mannan, Samjid H.; Clode, Mike P.; Chen, Keming; Whalley, David C.; Hutt, David A.; Conway, Paul P.
1999Investigation of a solder bumping technique for flip-chip interconnectionHutt, David A.; Rhodes, Daniel G.; Conway, Paul P.; Mannan, Samjid H.; Whalley, David C.
1995Modelling of the initial stages of the anisotropic adhesive joint assembly processMannan, Samjid H.; Whalley, David C.; Ogunjimi, Adebayo Oluyinka; Williams, David J.
2000Observations of solder paste reflow by means of electrical measurementsMannan, Samjid H.; Hutt, David A.; Whalley, David C.; Conway, Paul P.
2000Solder paste reflow modeling for flip chip assemblyMannan, Samjid H.; Wheeler, D.; Hutt, David A.; Whalley, David C.; Conway, Paul P.; Bailey, Chris
2000Under bump metallisation of fine pitch flip-chip using electroless nickel depositionLiu, Changqing; Hutt, David A.; Whalley, David C.; Conway, Paul P.; Mannan, Samjid H.
Showing results 1 to 17 of 17