Loughborough University
Leicestershire, UK
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Loughborough University

Loughborough University Institutional Repository

Browsing by Author Mannan, Samjid H.

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Showing results 10 to 17 of 17
Issue DateTitleAuthor(s)
2007Failure mechanisms of dummy IGBT assembles constructed using liquid in-Sn/Nb systemLi, Jianfeng; Sarvar, Farhad; Whalley, David C.; Hutt, David A.; Clode, Mike P.; Mannan, Samjid H.
2005Interactions between liquid Sn-Bi based solders and contact metals for high temperature applicationsLi, Jianfeng; Mannan, Samjid H.; Clode, Mike P.; Lobato, H.M.; Liu, Changqing; Whalley, David C.; Lawrence, F.T.; Jackson, G.; Steen, H.
2008Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnectsLi, Jianfeng; Mannan, Samjid H.; Clode, Mike P.; Chen, Keming; Whalley, David C.; Hutt, David A.; Conway, Paul P.
1999Investigation of a solder bumping technique for flip-chip interconnectionHutt, David A.; Rhodes, Daniel G.; Conway, Paul P.; Mannan, Samjid H.; Whalley, David C.
1995Modelling of the initial stages of the anisotropic adhesive joint assembly processMannan, Samjid H.; Whalley, David C.; Ogunjimi, Adebayo Oluyinka; Williams, David J.
2000Observations of solder paste reflow by means of electrical measurementsMannan, Samjid H.; Hutt, David A.; Whalley, David C.; Conway, Paul P.
2000Solder paste reflow modeling for flip chip assemblyMannan, Samjid H.; Wheeler, D.; Hutt, David A.; Whalley, David C.; Conway, Paul P.; Bailey, Chris
2000Under bump metallisation of fine pitch flip-chip using electroless nickel depositionLiu, Changqing; Hutt, David A.; Whalley, David C.; Conway, Paul P.; Mannan, Samjid H.
Showing results 10 to 17 of 17