Loughborough University
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Browsing by Author Whalley, David C.

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Issue DateTitleAuthor(s)
20083D study of thermal stresses in lead-free surface mount devicesHegde, Pradeep; Whalley, David C.; Silberschmidt, Vadim V.
2002Application of adhesives in MEMS and MOEMS assembly: a reviewSarvar, Farhad; Hutt, David A.; Whalley, David C.
1996Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part I - experimentOgunjimi, Adebayo Oluyinka; Mannan, Samjid H.; Whalley, David C.; Williams, David J.
1996Assembly of planar array components using anisotropic conducting adhesives: a benchmark study. Part II - theoryMannan, Samjid H.; Whalley, David C.; Ogunjimi, Adebayo Oluyinka; Williams, David J.
1997Automated adaptive control of the reflow soldering of electronic assembliesConway, Paul P.; Whalley, David C.; Wilkinson, M.; Williams, David J.
2006A case-based reasoning approach for low volume, high added value electronicsSegura-Velandia, Diana M.; West, Andrew A.; Conway, Paul P.; Whalley, David C.
2008Characterization of printed solder paste excess and bridge related defectsWilson, Antony R.; West, Andrew A.; Segura-Velandia, Diana M.; Conway, Paul P.; Whalley, David C.; Huertas-Quintero, Lina A.M.; Monfared, R.
2008A comparative study of the interfacial reaction between electroless Ni-P coatings and molten tinChen, Keming; Liu, C.C.; Whalley, David C.; Hutt, David A.; Li, Jianfeng; Mannan, Samjid H.
1993A comparison of modelling methods for electronic interconnect structuresOgunjimi, Adebayo Oluyinka; Whalley, David C.; Williams, David J.
2007Complex low volume electronics simulation tool to improve yield and reliabilitySegura-Velandia, Diana M.; Conway, Paul P.; West, Andrew A.; Whalley, David C.; Wilson, Antony R.; Huertas-Quintero, Lina A.M.
2001Computational modelling of the anisotropic conductive adhesive assembly processWhalley, David C.; Glinsky, Greg; Bailey, Chris; Liu, Johan
1998Conduction mechanisms in anisotropic conducting adhesive assemblyOguibe, Chucks N.; Mannan, Samjid H.; Whalley, David C.; Williams, David J.
2007Creep analysis of a lead-free surface mount deviceHegde, Pradeep; Whalley, David C.; Silberschmidt, Vadim V.
2009Creep damage study at powercycling of lead-free surface mount deviceHegde, Pradeep; Whalley, David C.; Silberschmidt, Vadim V.
2008Current leakage failure of conformally coated electronic assembliesDou, Guangbin; Webb, D.P.; Whalley, David C.; Hutt, David A.; Wilson, Antony R.
2006Deformation property measurement for single anisotropic conductive adhesive particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2009Direct-write techniques for maskless production of microelectronics: a review of current state-of-the-art technologiesZhang, Yan; Liu, Changqing; Whalley, David C.
2006The effect of co-planarity variation on anisotropic conductive adhesive assembliesDou, Guangbin; Whalley, David C.; Liu, Changqing
2010The effect of droplet ejection frequency on inkjet-etched micro via holesZhang, Yan; Liu, Changqing; Whalley, David C.
2012The effect of droplet ejection frequency on the dimensions of inkjet-etched micro-via holes in poly4(-vinyl phenol) thin filmsZhang, Yan; Liu, Changqing; Whalley, David C.
Showing results 1 to 20 of 66