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Browsing by Author Whalley, David C.

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Showing results 12 to 31 of 66
Issue DateTitleAuthor(s)
1998Conduction mechanisms in anisotropic conducting adhesive assemblyOguibe, Chucks N.; Mannan, Samjid H.; Whalley, David C.; Williams, David J.
2007Creep analysis of a lead-free surface mount deviceHegde, Pradeep; Whalley, David C.; Silberschmidt, Vadim V.
2009Creep damage study at powercycling of lead-free surface mount deviceHegde, Pradeep; Whalley, David C.; Silberschmidt, Vadim V.
2008Current leakage failure of conformally coated electronic assembliesDou, Guangbin; Webb, D.P.; Whalley, David C.; Hutt, David A.; Wilson, Antony R.
2006Deformation property measurement for single anisotropic conductive adhesive particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2009Direct-write techniques for maskless production of microelectronics: a review of current state-of-the-art technologiesZhang, Yan; Liu, Changqing; Whalley, David C.
2006The effect of co-planarity variation on anisotropic conductive adhesive assembliesDou, Guangbin; Whalley, David C.; Liu, Changqing
2010The effect of droplet ejection frequency on inkjet-etched micro via holesZhang, Yan; Liu, Changqing; Whalley, David C.
2012The effect of droplet ejection frequency on the dimensions of inkjet-etched micro-via holes in poly4(-vinyl phenol) thin filmsZhang, Yan; Liu, Changqing; Whalley, David C.
1997The effect of temperature ramp rate on flip-chip joint quality and reliability using anisotropically conductive adhesive on FR-4 substrateGustafsson, Katrin; Mannan, Samjid H.; Lai, Zonghe; Liu, Johan; Whalley, David C.; Williams, David J.
2004Electrical conduction characteristics of solid metal anisotropic conductive adhesive particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2004Electrical conductive, characteristics of ACA bonding: a review of the literature, current challenges and future prospects.Dou, Guangbin; Whalley, David C.; Liu, Changqing
1999Electrical method of monitoring percolation and abrasion of conducting spheres due to shear flow of a dense suspension in a narrow gapMannan, Samjid H.; Hutt, David A.; Whalley, David C.
2011Electrical properties of an isotropic conductive adhesive filled with silver coated polymer spheresJain, S.; Whalley, David C.; Cottrill, M.C.W.; Kristiansen, H.; Redford, K.; Nilsen, C.B.; Helland, T.; Liu, C.
2002Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activationHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2002Electroless nickel bumping of aluminium bondpads. Part 2 - electroless nickel platingHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2006Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnectsChen, Keming; Liu, Changqing; Whalley, David C.; Hutt, David A.; Li, Jianfeng; Mannan, Samjid H.
2007Failure mechanisms of dummy IGBT assembles constructed using liquid in-Sn/Nb systemLi, Jianfeng; Sarvar, Farhad; Whalley, David C.; Hutt, David A.; Clode, Mike P.; Mannan, Samjid H.
2008Finite element analysis of lead-free surface mount devicesHegde, Pradeep; Ochana, Andrew R.; Whalley, David C.; Silberschmidt, Vadim V.
2000IGBT package design for high power aircraft electronic systemsSarvar, Farhad; Whalley, David C.
Showing results 12 to 31 of 66