Loughborough University
Leicestershire, UK
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Browsing by Author Whalley, David C.

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Showing results 18 to 37 of 66
Issue DateTitleAuthor(s)
2006The effect of co-planarity variation on anisotropic conductive adhesive assembliesDou, Guangbin; Whalley, David C.; Liu, Changqing
2010The effect of droplet ejection frequency on inkjet-etched micro via holesZhang, Yan; Liu, Changqing; Whalley, David C.
2012The effect of droplet ejection frequency on the dimensions of inkjet-etched micro-via holes in poly4(-vinyl phenol) thin filmsZhang, Yan; Liu, Changqing; Whalley, David C.
1997The effect of temperature ramp rate on flip-chip joint quality and reliability using anisotropically conductive adhesive on FR-4 substrateGustafsson, Katrin; Mannan, Samjid H.; Lai, Zonghe; Liu, Johan; Whalley, David C.; Williams, David J.
2004Electrical conduction characteristics of solid metal anisotropic conductive adhesive particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2004Electrical conductive, characteristics of ACA bonding: a review of the literature, current challenges and future prospects.Dou, Guangbin; Whalley, David C.; Liu, Changqing
1999Electrical method of monitoring percolation and abrasion of conducting spheres due to shear flow of a dense suspension in a narrow gapMannan, Samjid H.; Hutt, David A.; Whalley, David C.
2011Electrical properties of an isotropic conductive adhesive filled with silver coated polymer spheresJain, S.; Whalley, David C.; Cottrill, M.C.W.; Kristiansen, H.; Redford, K.; Nilsen, C.B.; Helland, T.; Liu, C.
2002Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activationHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2002Electroless nickel bumping of aluminium bondpads. Part 2 - electroless nickel platingHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2006Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnectsChen, Keming; Liu, Changqing; Whalley, David C.; Hutt, David A.; Li, Jianfeng; Mannan, Samjid H.
2007Failure mechanisms of dummy IGBT assembles constructed using liquid in-Sn/Nb systemLi, Jianfeng; Sarvar, Farhad; Whalley, David C.; Hutt, David A.; Clode, Mike P.; Mannan, Samjid H.
2008Finite element analysis of lead-free surface mount devicesHegde, Pradeep; Ochana, Andrew R.; Whalley, David C.; Silberschmidt, Vadim V.
2000IGBT package design for high power aircraft electronic systemsSarvar, Farhad; Whalley, David C.
2013The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layersZhang, Yan; Liu, Changqing; Whalley, David C.
2012Influence of etching solvent evaporation on the size of micro-via holes in PVP thin filmsZhang, Yan; Liu, Changqing; Whalley, David C.
2008Integration issues in the development of a modelling and simulation tool for low volume high-complexity electronics manufactureWest, Andrew A.; Segura-Velandia, Diana M.; Conway, Paul P.; Whalley, David C.; Monfared, R.
2005Interactions between liquid Sn-Bi based solders and contact metals for high temperature applicationsLi, Jianfeng; Mannan, Samjid H.; Clode, Mike P.; Lobato, H.M.; Liu, Changqing; Whalley, David C.; Lawrence, F.T.; Jackson, G.; Steen, H.
2008Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnectsLi, Jianfeng; Mannan, Samjid H.; Clode, Mike P.; Chen, Keming; Whalley, David C.; Hutt, David A.; Conway, Paul P.
1999Investigation of a solder bumping technique for flip-chip interconnectionHutt, David A.; Rhodes, Daniel G.; Conway, Paul P.; Mannan, Samjid H.; Whalley, David C.
Showing results 18 to 37 of 66