Loughborough University
Leicestershire, UK
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Loughborough University

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Browsing by Author Whalley, David C.

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Showing results 26 to 45 of 66
Issue DateTitleAuthor(s)
2002Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activationHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2002Electroless nickel bumping of aluminium bondpads. Part 2 - electroless nickel platingHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2006Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnectsChen, Keming; Liu, Changqing; Whalley, David C.; Hutt, David A.; Li, Jianfeng; Mannan, Samjid H.
2007Failure mechanisms of dummy IGBT assembles constructed using liquid in-Sn/Nb systemLi, Jianfeng; Sarvar, Farhad; Whalley, David C.; Hutt, David A.; Clode, Mike P.; Mannan, Samjid H.
2008Finite element analysis of lead-free surface mount devicesHegde, Pradeep; Ochana, Andrew R.; Whalley, David C.; Silberschmidt, Vadim V.
2000IGBT package design for high power aircraft electronic systemsSarvar, Farhad; Whalley, David C.
2013The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layersZhang, Yan; Liu, Changqing; Whalley, David C.
2012Influence of etching solvent evaporation on the size of micro-via holes in PVP thin filmsZhang, Yan; Liu, Changqing; Whalley, David C.
2008Integration issues in the development of a modelling and simulation tool for low volume high-complexity electronics manufactureWest, Andrew A.; Segura-Velandia, Diana M.; Conway, Paul P.; Whalley, David C.; Monfared, R.
2005Interactions between liquid Sn-Bi based solders and contact metals for high temperature applicationsLi, Jianfeng; Mannan, Samjid H.; Clode, Mike P.; Lobato, H.M.; Liu, Changqing; Whalley, David C.; Lawrence, F.T.; Jackson, G.; Steen, H.
2008Interfacial reaction between molten Sn-Bi based solders and electroless Ni-P coatings for liquid solder interconnectsLi, Jianfeng; Mannan, Samjid H.; Clode, Mike P.; Chen, Keming; Whalley, David C.; Hutt, David A.; Conway, Paul P.
1999Investigation of a solder bumping technique for flip-chip interconnectionHutt, David A.; Rhodes, Daniel G.; Conway, Paul P.; Mannan, Samjid H.; Whalley, David C.
2006Materials and processes issues in fine pitch eutectic solder flip chip interconnectionLiu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C.
2004Materials and processes issues in fine pitch eutectic solder flip chip interconnection.Liu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C.
2006Mechanical and electrical characterisation of individual ACA conductor particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2008Mechanical characterization of individual Ni/Au coated microsize polymer particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2006Modeling of the power cycling performance of a Si on Si flip chip assemblyOchana, Andrew R.; Hutt, David A.; Whalley, David C.; Sarvar, Farhad; Al-Habaibeh, A.
1995Modelling of the initial stages of the anisotropic adhesive joint assembly processMannan, Samjid H.; Whalley, David C.; Ogunjimi, Adebayo Oluyinka; Williams, David J.
1998Novel rework techniques for electronic assembliesStennett, A.D.; Whalley, David C.
2000Observations of solder paste reflow by means of electrical measurementsMannan, Samjid H.; Hutt, David A.; Whalley, David C.; Conway, Paul P.
Showing results 26 to 45 of 66