Loughborough University
Leicestershire, UK
LE11 3TU
+44 (0)1509 263171
Loughborough University

Loughborough University Institutional Repository

Browsing by Author Whalley, David C.

Jump to: 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
or enter first few letters:   
Sort by: In order: Results/Page Authors/Record:
Showing results 41 to 60 of 70
Issue DateTitleAuthor(s)
2006Mechanical and electrical characterisation of individual ACA conductor particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2008Mechanical characterization of individual Ni/Au coated microsize polymer particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2006Modeling of the power cycling performance of a Si on Si flip chip assemblyOchana, Andrew R.; Hutt, David A.; Whalley, David C.; Sarvar, Farhad; Al-Habaibeh, A.
1995Modelling of the initial stages of the anisotropic adhesive joint assembly processMannan, Samjid H.; Whalley, David C.; Ogunjimi, Adebayo Oluyinka; Williams, David J.
2015Novel processes to enable deposition of metal coated polymer micro-spheres for flip-chip interconnectionsTao, Junlei; Whalley, David C.; Liu, Changqing; Wu, F.; Kristiansen, H.
1998Novel rework techniques for electronic assembliesStennett, A.D.; Whalley, David C.
2000Observations of solder paste reflow by means of electrical measurementsMannan, Samjid H.; Hutt, David A.; Whalley, David C.; Conway, Paul P.
2005Overmoulding of electronics for end of life recoveryHutt, David A.; Teh, Nee Joo; Sarvar, Farhad; Whalley, David C.; Palmer, Paul J.; Anderson, Paul; Kandasubramanian, Bala; Morris, Peter; Prosser, Stephen; O'Brien, Phillip
2012The penetration limit of poly(4-vinyl phenol) thin films for etching via holes by inkjet printingZhang, Yan; Liu, Changqing; Whalley, David C.
2014Process and performance modelling for individual ACA conductor particlesTao, Junlei; Whalley, David C.; Liu, Changqing; He, J.Y.
1991A process model of the infra-red reflow soldering of printed circuit board assembliesWhalley, David C.; Ogunjimi, Adebayo Oluyinka; Conway, Paul P.; Williams, David J.
1990Process variables in the reflow soldering of surface mountConway, Paul P.; Williams, David J.; Tang, A.C.T.; Sargent, P.M.; Whalley, David C.
2002Reflow soldering process simulation: a simplified modelWhalley, David C.
2014A review of LED technology trends and relevant thermal management strategiesPryde, J.R.; Whalley, David C.; Malalasekera, W.
2006RLC effects in fine pitch anisotropic conductive film connectionsDou, Guangbin; Chan, Y.C.; Morris, J.E.; Whalley, David C.
2000Scanning acoustic microscopy investigation of engineered flip-chip delaminationHutt, David A.; Whalley, David C.; Webb, D.P.; Hung, K.C.; Tang, C.W.; Conway, Paul P.; Chan, U.C.
2002A simplified model of the reflow soldering processWhalley, David C.
2008A simulation module for supporting the manufacture of high value added electronics manufacturingWest, Andrew A.; Huertas-Quintero, Lina A.M.; Segura-Velandia, Diana M.; Conway, Paul P.; Whalley, David C.; Wilson, Antony R.; Monfared, R.
2000Solder paste reflow modeling for flip chip assemblyMannan, Samjid H.; Wheeler, D.; Hutt, David A.; Whalley, David C.; Conway, Paul P.; Bailey, Chris
2005Stability of Ni3P and its effect on the interfacial reaction between electroless Ni-P and molten tinChen, Keming; Liu, Changqing; Whalley, David C.; Hutt, David A.
Showing results 41 to 60 of 70