Loughborough University
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Browsing by Author Whalley, David C.

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Issue DateTitleAuthor(s)
2008Characterization of printed solder paste excess and bridge related defectsWilson, Antony R.; West, Andrew A.; Segura-Velandia, Diana M.; Conway, Paul P.; Whalley, David C.; Huertas-Quintero, Lina A.M.; Monfared, R.
2008A comparative study of the interfacial reaction between electroless Ni-P coatings and molten tinChen, Keming; Liu, C.C.; Whalley, David C.; Hutt, David A.; Li, Jianfeng; Mannan, Samjid H.
1993A comparison of modelling methods for electronic interconnect structuresOgunjimi, Adebayo Oluyinka; Whalley, David C.; Williams, David J.
2007Complex low volume electronics simulation tool to improve yield and reliabilitySegura-Velandia, Diana M.; Conway, Paul P.; West, Andrew A.; Whalley, David C.; Wilson, Antony R.; Huertas-Quintero, Lina A.M.
2001Computational modelling of the anisotropic conductive adhesive assembly processWhalley, David C.; Glinsky, Greg; Bailey, Chris; Liu, Johan
1998Conduction mechanisms in anisotropic conducting adhesive assemblyOguibe, Chucks N.; Mannan, Samjid H.; Whalley, David C.; Williams, David J.
2007Creep analysis of a lead-free surface mount deviceHegde, Pradeep; Whalley, David C.; Silberschmidt, Vadim V.
2009Creep damage study at powercycling of lead-free surface mount deviceHegde, Pradeep; Whalley, David C.; Silberschmidt, Vadim V.
2008Current leakage failure of conformally coated electronic assembliesDou, Guangbin; Webb, D.P.; Whalley, David C.; Hutt, David A.; Wilson, Antony R.
2006Deformation property measurement for single anisotropic conductive adhesive particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2009Direct-write techniques for maskless production of microelectronics: a review of current state-of-the-art technologiesZhang, Yan; Liu, Changqing; Whalley, David C.
2006The effect of co-planarity variation on anisotropic conductive adhesive assembliesDou, Guangbin; Whalley, David C.; Liu, Changqing
2010The effect of droplet ejection frequency on inkjet-etched micro via holesZhang, Yan; Liu, Changqing; Whalley, David C.
2012The effect of droplet ejection frequency on the dimensions of inkjet-etched micro-via holes in poly4(-vinyl phenol) thin filmsZhang, Yan; Liu, Changqing; Whalley, David C.
1997The effect of temperature ramp rate on flip-chip joint quality and reliability using anisotropically conductive adhesive on FR-4 substrateGustafsson, Katrin; Mannan, Samjid H.; Lai, Zonghe; Liu, Johan; Whalley, David C.; Williams, David J.
2004Electrical conduction characteristics of solid metal anisotropic conductive adhesive particlesDou, Guangbin; Whalley, David C.; Liu, Changqing
2004Electrical conductive, characteristics of ACA bonding: a review of the literature, current challenges and future prospects.Dou, Guangbin; Whalley, David C.; Liu, Changqing
1999Electrical method of monitoring percolation and abrasion of conducting spheres due to shear flow of a dense suspension in a narrow gapMannan, Samjid H.; Hutt, David A.; Whalley, David C.
2011Electrical properties of an isotropic conductive adhesive filled with silver coated polymer spheresJain, S.; Whalley, David C.; Cottrill, M.C.W.; Kristiansen, H.; Redford, K.; Nilsen, C.B.; Helland, T.; Liu, C.
2002Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activationHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
Showing results 7 to 26 of 66