|
|
Browsing by Author Whalley, David C.
Showing results 38 to 57 of 66
| Issue Date | Title | Author(s) | | 2006 | Materials and processes issues in fine pitch eutectic solder flip chip interconnection | Liu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C. |
| 2004 | Materials and processes issues in fine pitch eutectic solder flip chip interconnection. | Liu, Changqing; Hendriksen, M.W.; Hutt, David A.; Conway, Paul P.; Whalley, David C. |
| 2006 | Mechanical and electrical characterisation of individual ACA conductor particles | Dou, Guangbin; Whalley, David C.; Liu, Changqing |
| 2008 | Mechanical characterization of individual Ni/Au coated microsize polymer particles | Dou, Guangbin; Whalley, David C.; Liu, Changqing |
| 2006 | Modeling of the power cycling performance of a Si on Si flip chip assembly | Ochana, Andrew R.; Hutt, David A.; Whalley, David C.; Sarvar, Farhad; Al-Habaibeh, A. |
| 1995 | Modelling of the initial stages of the anisotropic adhesive joint assembly process | Mannan, Samjid H.; Whalley, David C.; Ogunjimi, Adebayo Oluyinka; Williams, David J. |
| 1998 | Novel rework techniques for electronic assemblies | Stennett, A.D.; Whalley, David C. |
| 2000 | Observations of solder paste reflow by means of electrical measurements | Mannan, Samjid H.; Hutt, David A.; Whalley, David C.; Conway, Paul P. |
| 2005 | Overmoulding of electronics for end of life recovery | Hutt, David A.; Teh, Nee Joo; Sarvar, Farhad; Whalley, David C.; Palmer, Paul J.; Anderson, Paul; Kandasubramanian, Bala; Morris, Peter; Prosser, Stephen; O'Brien, Phillip |
| 2012 | The penetration limit of poly(4-vinyl phenol) thin films for etching via holes by inkjet printing | Zhang, Yan; Liu, Changqing; Whalley, David C. |
| 1991 | A process model of the infra-red reflow soldering of printed circuit board assemblies | Whalley, David C.; Ogunjimi, Adebayo Oluyinka; Conway, Paul P.; Williams, David J. |
| 1990 | Process variables in the reflow soldering of surface mount | Conway, Paul P.; Williams, David J.; Tang, A.C.T.; Sargent, P.M.; Whalley, David C. |
| 2002 | Reflow soldering process simulation: a simplified model | Whalley, David C. |
| 2006 | RLC effects in fine pitch anisotropic conductive film connections | Dou, Guangbin; Chan, Y.C.; Morris, J.E.; Whalley, David C. |
| 2000 | Scanning acoustic microscopy investigation of engineered flip-chip delamination | Hutt, David A.; Whalley, David C.; Webb, D.P.; Hung, K.C.; Tang, C.W.; Conway, Paul P.; Chan, U.C. |
| 2002 | A simplified model of the reflow soldering process | Whalley, David C. |
| 2008 | A simulation module for supporting the manufacture of high value added electronics manufacturing | West, Andrew A.; Huertas-Quintero, Lina A.M.; Segura-Velandia, Diana M.; Conway, Paul P.; Whalley, David C.; Wilson, Antony R.; Monfared, R. |
| 2000 | Solder paste reflow modeling for flip chip assembly | Mannan, Samjid H.; Wheeler, D.; Hutt, David A.; Whalley, David C.; Conway, Paul P.; Bailey, Chris |
| 2005 | Stability of Ni3P and its effect on the interfacial reaction between electroless Ni-P and molten tin | Chen, Keming; Liu, Changqing; Whalley, David C.; Hutt, David A. |
| 2008 | A substrateless process for sustainable manufacture of electronic assemblies | Webb, D.P.; Hutt, David A.; Whalley, David C.; Palmer, Paul J. |
Showing results 38 to 57 of 66
|
