Loughborough University
Leicestershire, UK
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Loughborough University

Loughborough University Institutional Repository

Browsing by Author Whalley, David C.

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Issue DateTitleAuthor(s)
1990Tailoring thermal profiles for the reflow of SMD assembliesTang, A.C.T.; Whalley, David C.; Williams, David J.
1987Temperature cycling of surface mounted thick film 'zero-ohm' jumpersWhalley, David C.; Campbell, D.S.
2008Thermal and electrical modelling of polymer cored BGA interconnectsWhalley, David C.; Kristiansen, H.; Marin, F. Guillen
1999Thermal design of high power semiconductor packages for aircraft electronic systemsSarvar, Farhad; Whalley, David C.
2006Thermal interface materials - a review of the state of the artSarvar, Farhad; Whalley, David C.; Conway, Paul P.
1993Thermal stress analysis of conductive adhesive jointsOgunjimi, Adebayo Oluyinka; Whalley, David C.; Williams, David J.
2008Thermo-mechanical damage accumulation during power cycling of lead-free surface mount solder jointsHegde, Pradeep; Whalley, David C.; Silberschmidt, Vadim V.
2004Thermo-mechanical modelling of polymer encapsulated electronicsSarvar, Farhad; Teh, Nee Joo; Whalley, David C.; Hutt, David A.; Palmer, Paul J.
2000Under bump metallisation of fine pitch flip-chip using electroless nickel depositionLiu, Changqing; Hutt, David A.; Whalley, David C.; Conway, Paul P.; Mannan, Samjid H.
Showing results 58 to 66 of 66