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Browsing by Author Xu, Hui

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Issue DateTitleAuthor(s)
2008Effect of thermal aging on interfacial behaviour of copper ball bondsXu, Hui; Liu, Changqing; Silberschmidt, Vadim V.
2008Effects of process parameters on bondability in thermosonic copper ball bondingXu, Hui; Liu, Changqing; Silberschmidt, Vadim V.; Wang, Honghui
2008TEM microstructural analysis of as-bonded copper ball bonds on aluminum metallizationXu, Hui; Liu, Changqing; Silberschmidt, Vadim V.; Chen, Zhong
2010Thermosonic ball bonding: a study of bonding mechanism and interfacial evolutionXu, Hui
Showing results 1 to 4 of 4