Loughborough University
Leicestershire, UK
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Loughborough University

Loughborough University Institutional Repository

Browsing by Author Chen, Guang

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Issue DateTitleAuthor(s)
2018Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageingWang, Jing; Chen, Guang; Sun, Fulong; Zhou, Zhaoxia; Liu, Zhi-Quan; Liu, Changqing
2017Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnectsLiu, Li; Chen, Zhiwen; Zhou, Zhaoxia; Chen, Guang; Wu, Fengshun; Liu, Changqing
2015Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solderChen, Guang; Wu, Fengshun; Liu, Changqing; Xia, Weisheng; Liu, Hui
2017An investigation into nano-particulates reinforced SAC305-based composite solders under electro- and thermo-migration conditionsChen, Guang
2017An investigation into the effect of dry bake on the solderability degradation of electrodeposited tin finishesWang, Jing; Chen, Guang; Forbes, Henry; Christopoulos, Katerina; Liu, Changqing; Sun, Liangquan; Shang, Panju
2018Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradientChen, Guang; Liu, Li; Silberschmidt, Vadim V.; Liu, Changqing; Wu, Fengshun; Chan, Y.C.
2016Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheetsChen, Guang; Wu, Fengshun; Liu, Changqing; Silberschmidt, Vadim V.; Chan, Y.C.
2016Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: physical properties, solderability and microstructural evolution under isothermal ageingChen, Guang; Peng, Hao; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun
2016Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycleChen, Guang; Liu, Li; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun
2016Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticlesChen, Guang; Liu, Li; Du, Juan; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun
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