Loughborough University
Leicestershire, UK
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Browsing by Author Chen, Zhiwen

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Issue DateTitleAuthor(s)
2017Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnectsLiu, Li; Chen, Zhiwen; Zhou, Zhaoxia; Chen, Guang; Wu, Fengshun; Liu, Changqing
2017Evolution of the hardness and Young’s moduli of interlayers in Sn99Cu1/Cu solder joints subjected to isothermal ageingChen, Zhiwen; Liu, Changqing; An, Bing; Wu, Yiping; Liu, Li
2016Micro-mechanical and fracture characteristics of Cu6Sn5 and Cu3Sn intermetallic compounds under micro-cantilever bendingLiu, Li; Chen, Zhiwen; Liu, Changqing; Wu, Yiping; An, Bing
2015Micro-mechanical characteristics and dimensional change of Cu-Sn interconnects due to growth of interfacial intermetallic compoundsChen, Zhiwen
2015Perpendicular growth characteristics of Cu-Sn intermetallic compounds at the surface of Sn99Cu1/Cu solder interconnectsChen, Zhiwen; Liu, Changqing; Wu, Yiping; An, Bing
2015Study of height reduction of Sn99Cu1/Cu solder joints as a result of isothermal agingChen, Zhiwen; Liu, Changqing; Wu, Yiping; An, Bing; Zhou, Longzao
Showing results 1 to 6 of 6