Loughborough University
Leicestershire, UK
LE11 3TU
+44 (0)1509 263171
Loughborough University

Loughborough University Institutional Repository

Browsing by Author Liu, Li

Jump to: 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
or enter first few letters:   
Sort by: In order: Results/Page Authors/Record:
Showing results 1 to 9 of 9
Issue DateTitleAuthor(s)
2016Deposition and application of electroless Ni–W–P under bump metallisation for high temperature lead-free solder interconnectsLiu, Li
2017Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnectsLiu, Li; Chen, Zhiwen; Zhou, Zhaoxia; Chen, Guang; Wu, Fengshun; Liu, Changqing
2017Evolution of the hardness and Young’s moduli of interlayers in Sn99Cu1/Cu solder joints subjected to isothermal ageingChen, Zhiwen; Liu, Changqing; An, Bing; Wu, Yiping; Liu, Li
2017Interfacial reaction and microstructural evolution between Au-Ge solder and electroless Ni-W-P metallization in high temperature electronics interconnectsLiu, Li; Cui, Jinzi; Wang, Jing; Zhou, Zhaoxia; Johnson, R. Wayne; Liu, Changqing
2016Micro-mechanical and fracture characteristics of Cu6Sn5 and Cu3Sn intermetallic compounds under micro-cantilever bendingLiu, Li; Chen, Zhiwen; Liu, Changqing; Wu, Yiping; An, Bing
2018Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradientChen, Guang; Liu, Li; Silberschmidt, Vadim V.; Liu, Changqing; Wu, Fengshun; Chan, Y.C.
2016Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycleChen, Guang; Liu, Li; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun
2018Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopyZhou, Zhaoxia; Liu, Li; Liu, Changqing
2016Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticlesChen, Guang; Liu, Li; Du, Juan; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun
Showing results 1 to 9 of 9