Loughborough University
Leicestershire, UK
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Loughborough University

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Browsing by Author Wu, Fengshun

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Issue DateTitleAuthor(s)
2017Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnectsLiu, Li; Chen, Zhiwen; Zhou, Zhaoxia; Chen, Guang; Wu, Fengshun; Liu, Changqing
2015Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solderChen, Guang; Wu, Fengshun; Liu, Changqing; Xia, Weisheng; Liu, Hui
2019Formation and homogenisation of SnCu interconnects by self-propagated exothermic reactive bondingZhu, Wenbo; Wang, Xiaoting; Liu, Changqing; Zhou, Zhaoxia; Wu, Fengshun
2015Microstructural and mechanical analysis on Cu-Sn intermetallic micro-joints under isothermal conditionMo, L.; Chen, Zhichao; Wu, Fengshun; Liu, Changqing
2018Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradientChen, Guang; Liu, Li; Silberschmidt, Vadim V.; Liu, Changqing; Wu, Fengshun; Chan, Y.C.
2018Microstructural evolution of Cu–Sn–Ni compounds in full intermetallic micro-joint and in situ micro-bending testMo, Liping; Guo, Chaowei; Zhou, Zheng; Wu, Fengshun; Liu, Changqing
2016Microstructures and properties of new Sn-Ag-Cu lead-free solder reinforced with Ni-coated graphene nanosheetsChen, Guang; Wu, Fengshun; Liu, Changqing; Silberschmidt, Vadim V.; Chan, Y.C.
2015Novel processes to enable deposition of metal coated polymer micro-spheres for flip-chip interconnectionsTao, Junlei; Whalley, David C.; Liu, Changqing; Wu, Fengshun; Kristiansen, H.
2016Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: physical properties, solderability and microstructural evolution under isothermal ageingChen, Guang; Peng, Hao; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun
2016Retained ratio of reinforcement in SAC305 composite solder joints: effect of reinforcement type, processing and reflow cycleChen, Guang; Liu, Li; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun
2016Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticlesChen, Guang; Liu, Li; Du, Juan; Silberschmidt, Vadim V.; Chan, Y.C.; Liu, Changqing; Wu, Fengshun
Showing results 1 to 11 of 11