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Browsing by Author Wu, Zhiyong

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Issue DateTitleAuthor(s)
2014Effects of the microstructure of copper through-silicon vias on their thermally induced linear elastic mechanical behaviorWu, Zhiyong; Huang, Zhiheng; Ma, Yucheng; Xiong, Hua; Conway, Paul P.
2014Microstructure-based multiphysics modeling for semiconductor integration and packagingHuang, Zhiheng; Xiong, Hua; Wu, Zhiyong; Conway, Paul P.; Davies, Hugh; Dinsdale, Alan; En, Yunfei; Zeng, Qingfeng
2013Multiscale microstructures and microstructural effects on the reliability of microbumps in three-dimensional integrationHuang, Zhiheng; Xiong, Hua; Wu, Zhiyong; Conway, Paul P.; Altmann, Frank
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