Loughborough University
Leicestershire, UK
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Loughborough University

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Showing results 5324 to 5343 of 18737
Issue DateTitleAuthor(s)
2014Electrodeposition and characterization of nanocrystalline Ni-NbOx composite coatings from glycol-based electrolytes for high temperature electronics packagingWang, Jing; Wilcox, G.D.; Mortimer, Roger J.; Liu, Changqing; Ashworth, Mark A.
2007Electrodeposition at the liquid/liquid interface: the chronoamperometric response as a function of applied potential differencePlatt, Mark; Dryfe, Robert A.W.
2014Electrodeposition of CdTe films on CdS layers deposited using magnetron sputtering and chemical bath depositionLisco, Fabiana; Abbas, Ali; Bowers, Jake W.; Claudio, Gianfranco; Kaminski, Piotr M.; Walls, Michael
2010Electrodeposition of indium bumps for ultrafine pitch interconnectionsTian, Yingtao
1981Electrodeposition of metals in a rotating cylinder electrode reactorWalsh, Francis C.
1999The electrodeposition of palladium-iron alloysBaumgaertner, Manfred E.
2003Electrodeposition of palladium nanoparticles at the liquid-liquid interface using porous alumina templatesPlatt, Mark; Dryfe, Robert A.W.; Roberts, Edward P.L.
1984The electrodeposition of tin and lead-tin based alloysSamel, Mohammad A.F.
2014The electrodeposition of tin coatings from deep eutectic solvents and their subsequent whisker growthStuttle, Christopher
2009The electrodeposition of zinc alloys from ionic liquid electrolytesCantwell, P.A.; Chung, P.P.; Jiang, Han; Wilcox, G.D.; Critchlow, Gary W.
2008Electrodeposition of zinc-manganese alloy coatings from ionic liquid electrolytesChung, P.P.; Cantwell, P.A.; Wilcox, G.D.; Critchlow, Gary W.
2010Electrodynamics of fluxon and semifluxon in 2D T-shaped Josephson Nano-JunctionsHassan, Hanaa S.
2009Electroless metallisation of glass for electrical interconnect applicationsCui, Xiaoyun
2002Electroless nickel bumping of aluminium bondpads. Part 1 - surface pre-treatment and activationHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2002Electroless nickel bumping of aluminium bondpads. Part 2 - electroless nickel platingHutt, David A.; Liu, Changqing; Conway, Paul P.; Whalley, David C.; Mannan, Samjid H.
2006Electroless Ni-W-P alloys as barrier coatings for liquid solder interconnectsChen, Keming; Liu, Changqing; Whalley, David C.; Hutt, David A.; Li, Jianfeng; Mannan, Samjid H.
2008Electroluminescent light sources via soft lithographyYoung, R.J.H.; Evans, Peter S.A.; Hay, Gareth I.; Southee, Darren J.; Harrison, David J.
2010Electromagnetically induced transparency on a single artificial atomAbdumalikov, A.A.; Astafiev, O.V.; Zagoskin, Alexandre M.; Pashkin, Yu A.; Nakamura, Y.; Tsai, J.S.
2003Electromagnetic bandgap antennas and components for microwave and (Sub)millimeter wave applicationsde Maagt, Peter; Gonzalo, Ramon; Vardaxoglou, J.C.; Baracco, Jean-Marc
2013Electromagnetic characterisation of materials using complementary frequency selective surfacesVardaxoglou, J.C.; Njoku, Chinwe C.; Whittow, W.G.
Showing results 5324 to 5343 of 18737