Loughborough University
Leicestershire, UK
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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/10236

Title: Modelling and simulation of paradigms for printed circuit board assembly to support the UK's competency in high reliability electronics
Authors: Wilson, Antony R.
Keywords: SMT Reflow
Solder paste printing
Component placement
Dynamic behaviour of components
Issue Date: 2012
Publisher: © Antony Wilson
Abstract: The fundamental requirement of the research reported within this thesis is the provision of physical models to enable model based simulation of mainstream printed circuit assembly (PCA) process discrete events for use within to-be-developed (or under development) software tools which codify cause & effects knowledge for use in product and process design optimisation. To support a national competitive advantage in high reliability electronics UK based producers of aircraft electronic subsystems require advanced simulation tools which offer model based guidance. In turn, maximization of manufacturability and minimization of uncontrolled rework must therefore enhance inservice sustainability for ‘power-by-the-hour’ commercial aircraft operation business models. [Continues.]
Description: A Doctoral Thesis. Submitted in partial fulfillment of the requirements for the award of Doctor of Philosophy of Loughborough University.
Version: Closed Access
URI: https://dspace.lboro.ac.uk/2134/10236
Appears in Collections:PhD Theses (Mechanical, Electrical and Manufacturing Engineering)

Files associated with this item:

File Description SizeFormat
Form-2011-Wilson.pdf11.17 MBAdobe PDFView/Open
Thesis-2011-Wilson.pdf6.85 MBAdobe PDFView/Open

 

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