The microelectronics industry requires continuous advances due to ever-evolving
technology and the corresponding need for higher density substrates with smaller
features. Specifically, new dielectric materials with enhanced electrical properties are
needed. At the same time, adhesion must be maintained in order to preserve package
reliability and mechanical performance. As a result, this research investigates the use
of thin glass sheets as an alternative substrate material as it offers a number of
advantages including coefficient of thermal expansion similar to silicon, good
dielectric properties and optical transparency to assist in the alignment of buried
features. As part of this project it was necessary to deposit metallic coatings onto the
glass sheets to create electrical tracks, pads and microvias. In order to meet these
requirements, the metallisation of both smooth as received glass surfaces and surfaces
roughened by laser machining using electroless copper and nickel deposition were
investigated. This study resulted in a number of important conclusions about the roles
of chemical bonding and mechanical anchoring in both the adhesion and catalyst
adsorption, that are key factors in the electroless metallisation process.....
A Doctoral Thesis. Submitted in partial fulfillment of the requirements for the award of Doctor of Philosophy of Loughborough University.