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Please use this identifier to cite or link to this item: https://dspace.lboro.ac.uk/2134/10303

Title: Electroless metallisation of glass for electrical interconnect applications
Authors: Cui, Xiaoyun
Keywords: Glass substrate
Electroless copper deposition
Electroless nickel deposition
Thin film adhesion
Micro-mechanical properties
Scratch test
Laser machining
Issue Date: 2009
Publisher: © Xiaoyun Cui
Abstract: The microelectronics industry requires continuous advances due to ever-evolving technology and the corresponding need for higher density substrates with smaller features. Specifically, new dielectric materials with enhanced electrical properties are needed. At the same time, adhesion must be maintained in order to preserve package reliability and mechanical performance. As a result, this research investigates the use of thin glass sheets as an alternative substrate material as it offers a number of advantages including coefficient of thermal expansion similar to silicon, good dielectric properties and optical transparency to assist in the alignment of buried features. As part of this project it was necessary to deposit metallic coatings onto the glass sheets to create electrical tracks, pads and microvias. In order to meet these requirements, the metallisation of both smooth as received glass surfaces and surfaces roughened by laser machining using electroless copper and nickel deposition were investigated. This study resulted in a number of important conclusions about the roles of chemical bonding and mechanical anchoring in both the adhesion and catalyst adsorption, that are key factors in the electroless metallisation process.....
Description: A Doctoral Thesis. Submitted in partial fulfillment of the requirements for the award of Doctor of Philosophy of Loughborough University.
URI: https://dspace.lboro.ac.uk/2134/10303
Appears in Collections:PhD Theses (Mechanical, Electrical and Manufacturing Engineering)

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