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Title: A study of debinding behaviour and microstructural development of sintered Al-Cu-Sn alloy
Authors: Kim, Jung-Sik
Chang, Isaac T.
Falticeanu, C.L.
Davies, G.J.
Jiang, Kyle
Keywords: Differential scanning calorimetry (DSC
Micron-sized aluminium powder
Nanosized alloying powder
Thermogravimetric analysis (TGA)
X-ray diffractometry
Issue Date: 2007
Publisher: © Trans Tech Publications
Citation: KIM, J-S. ... et al, 2007. A study of debinding behaviour and microstructural development of sintered Al-Cu-Sn alloy. IN: Progress in Powder Metallurgy. Proceedings of the 2006 Powder Metallurgy, World Congress & Exhibition (PM 2006), 24th-28th September 2006, Busan, Korea. Trans Tech Publications, vol. 1 pp. 769 - 772
Series/Report no.: Materials Science Forum;534-536
Abstract: A new approach is explored to achieve sintered aluminium alloy from metallic powder mixtures without compression or adding Mg. In this approach, mixtures of micron-sized aluminium powder (average size of 2.5 μm) and nano-sized alloying elemental powder of Cu and Sn (less than of 70nm), at appropriate proportions to compositions of Al-6wt%Cu, Al-6wt%Cu-3wt%Sn with and without adhesive binder were prepared by magnetic stirring. Then, the powder mixture was poured into a crucible and heat treated at a temperature of 600°C for 11 hours in inert atmosphere of N2 or Ar. In this paper, we investigate the debinding behavior of loosely packed Al-based powder mixture and the microstructural development and mechanical property sintered parts using a combination of thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), X-ray diffractrometry (XRD) and hardness test.
Description: This is a conference paper. It was published in the series Materials Science Forum and the definitive version is available at: http://www.scientific.net/MSF.534-536.769
Version: Accepted for publication
DOI: 10.4028/www.scientific.net/MSF.534-536.769
URI: https://dspace.lboro.ac.uk/2134/11220
Publisher Link: http://www.scientific.net
ISBN: 9780878494194
ISSN: 1662-9752
Appears in Collections:Conference Papers and Presentations (Aeronautical and Automotive Engineering)

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