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|Title: ||The use of areal surface texture parameters to characterize the mechanical bond strength of copper on glass plating applications|
|Authors: ||He, Baofeng|
Petzing, Jon N.
Conway, Paul P.
Leach, Richard K.
|Issue Date: ||2012|
|Publisher: ||© Queen’s Printer and Controller of HMSO|
|Citation: ||HE, B. ... et al., 2012. The use of areal surface texture parameters to characterize the mechanical bond strength of copper on glass plating applications. National Physical Laboratory, NPL REPORT ENG 34, January 2012, 25pp.|
|Abstract: ||This report describe research into the role that surface topography plays in influencing the mechanical bond strength of the electroless copper plating of novel glass substrates. The work considers bespoke laser machining of glass substrates, electroless plating chemistry, areal surface topography analysis using non-contact optical techniques, paramaterization of the surfaces using ISO 25178 areal parameters, and scratch testing of plated copper to measure the adhesive bond strength. By correlating bond strength to appropriate areal parameters, it is anticipated that better mechanical adhesive potential of machined glass surfaces can be achieved.|
|Description: ||This NPL report is available from the website: http://publications.npl.co.uk/|
|Sponsor: ||National Physical Laboratory|
|Appears in Collections:||Official Reports (Mechanical, Electrical and Manufacturing Engineering)|
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