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|Title: ||The assessment of areal surface texture parameters for characterizing the adhesive bond strength of copper plated micro-machined glass.|
|Authors: ||He, Baofeng|
Petzing, Jon N.
Leach, Richard K.
Conway, Paul P.
|Issue Date: ||2012|
|Publisher: ||© EUSPEN|
|Citation: ||HE, B. ... et al., 2012. The assessment of areal surface texture parameters for characterizing the adhesive bond strength of copper plated micro-machined glass. IN: Shore, P., Spaan, H. and Burke, T. (eds.) Proceedings of the 12th International Conference of the European Society for Precision Engineering & Nanotechnology, Stockholm, Sweden, 4 - 7 June 2012, Volume 1, pp. 92 - 95.|
|Abstract: ||The micro-electronics industry is investigating glass as an alternative printed circuit board material and interposer. Electroless copper plating of glass is required for tracks and interconnects, but understanding of how the surface topography of the glass substrate affects the mechanics of the copper/glass bond quality is limited. Areal surface texture parameters provide the potential for characterizing key surface features associated with improving copper/glass bonding. Laser ablation techniques have been used to prepare glass surfaces with micro-scale structured features, and these features have been quantified using areal parameters. The copper/glass bond strength has been quantified using scratch testing techniques, with statistical analysis identifying strongly correlating areal parameters that may be used for predictive design of glass surfaces.|
|Description: ||This extended abstract was accepted for publication in the proceedings of the 12th EUSPEN conference. The publisher's website is at: http://www.euspen.eu/|
|Version: ||Accepted for publication|
|Publisher Link: ||https://www.euspen.eu/content/News-and-events/euspen-events/Stockholm%202012/proceedings/VolumePro1/VolumePro1/HTML/index.html#/92/|
|Appears in Collections:||Conference Papers and Contributions (Mechanical, Electrical and Manufacturing Engineering)|
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