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Title: The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers
Authors: Zhang, Yan
Liu, Changqing
Whalley, David C.
Keywords: Inkjet
Polymer etching
Polymer patterning
Via hole
Printed electronics
Issue Date: 2013
Publisher: © American Institute of Physics
Citation: ZHANG, Y., LIU, C. and WHALLEY, D.C., 2013. The impact of substrate temperature on the size and aspect ratio of inkjet-dissolved via holes in thin poly(4-vinyl phenol) dielectric layers. Applied Physics Letters, 102 (10), 103303, doi: 10.1063/1.4795447
Abstract: The authors demonstrate the effect of substrate temperature on the relationship between the inkjet-etched via hole size and the number of drops of etchant dispensed. A mechanism for the different via hole size evolution versus the number of drops is proposed. An explanation for the interrelationship between the solvent evaporation rate and polymer re-deposition is presented. The aspect ratio of via holes produced is found to increase with the substrate temperature. Therefore, higher temperatures can be used to reduce the size and increase the aspect ratio of via holes fabricated by inkjet etching.
Description: This article was published in the journal, Applied Physics Letters [© American Institute of Physics] and may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The article may be found at: http://dx.doi.org/10.1063/1.4795447
Version: Published
DOI: 10.1063/1.4795447
URI: https://dspace.lboro.ac.uk/2134/11969
Publisher Link: http://dx.doi.org/10.1063/1.4795447
ISSN: 0003-6951
Appears in Collections:Published Articles (Mechanical, Electrical and Manufacturing Engineering)

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