The explosion of SMT and highly-density packages has resulted in more complex and
higher density board designs in order to incorporate more features into products while
reducing overall package size. This has, in tum, created major challenges for the surface
mount manufacturing process, particularly in solder screen printing, component
placement, and reflow soldering. Investigation into these areas will contribute to our
understanding of the origin of post reflow defects in surface mount assembly and
improvement in product quality.
The thesis particularly explores empirically the relationship between screen printed paste
deposit, the final joint geometry and the fluxing behaviour within the reflowing solder. The thesis also demonstrates the effect of modified screen printing parameters and the lead geometry.
A Doctoral Thesis. Submitted in partial fulfilment of the requirements for the award of Doctor of Philosophy of Loughborough University.